| Allicdata Part #: | ATS-20H-140-C1-R0-ND |
| Manufacturer Part#: |
ATS-20H-140-C1-R0 |
| Price: | $ 3.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-140-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.87721 |
| 30 +: | $ 2.79909 |
| 50 +: | $ 2.64361 |
| 100 +: | $ 2.48812 |
| 250 +: | $ 2.33264 |
| 500 +: | $ 2.25488 |
| 1000 +: | $ 2.02162 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink devices are a key component used in many electronic applications. The ATS-20H-140-C1-R0 is among the best-known heat sinks on the market, due to its impressive performance. Its rugged construction makes ATS-20H-140-C1-R0 capable of handling hefty loads, while greatly aiding with cooling applications, in order to prevent overheating.
An ATS-20H-140-C1-R0 thermal heat sink typically involves a large metal fin or base and a heat pipe that is connected through either a two-phase or direct-contact method. The fin/base is designed to dissipate the heat being generated, while the heat pipe utilizes a convection unit for the thermal heat transfer. The two processes work together to maintain a much cooler operating environment.
The ATS-20H-140-C1-R0 thermal heat sink can be used in a wide range of applications. It is often utilized to maintain an optimal temperature level in server and other computer hardware. It can also be used with industrial-grade electronic components and systems, which tend to operate in much higher temperatures. Additionally, it can be utilized to reduce the size and weight of a system by improving cooling performance.
When it comes to the ATS-20H-140-C1-R0 heat sink’s working principle, there are two key mechanisms that come into play. The conductive heat transfer involves the movement of heat from one component to another, by way of a direct physical contact between them. Meanwhile, the convective heat transfer, on the other hand, involves the transfer of heat via a gas or liquid, in order to create turbulence.
The ATS-20H-140-C1-R0 thermally controlled heat sink is designed with a combination of factors to increase the performance of the device, including an optimized fin/base structure, a highly effective convective section, and a direct-contact interface. With these components in combination, the device is able to effectively transfer heat away from a component or system, while also improving system performance.
In conclusion, the ATS-20H-140-C1-R0 thermal heat sink is an ideal solution for cooling applications and other electronic hardware applications. Its design combines several components that enable effective heat transfer, while its construction stands up to heavy loads. Compared to other heat sink models, ATS-20H-140-C1-R0 offers high performance and efficiency, which is why it remains one of the most popular options for cooling solutions.
The specific data is subject to PDF, and the above content is for reference