| Allicdata Part #: | ATS34179-ND |
| Manufacturer Part#: |
ATS-20H-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are critical for achieving the desired electrical performance of electronic products. Heat generated by electronic components during operation can create a decrease in system reliability, leading to unpredictable consequences. By investing in thermal management products such as the ATS-20H-142-C2-R0, engineers can effectively keep heat in check and design products for better performance. In this article, we’ll discuss the application field and working principle of the ATS-20H-142-C2-R0.
The ATS-20H-142-C2-R0 is a heat sink designed for usage with high-powered components such as semiconductors, processors, and power transistors. It is also used in the mounting of vertical drive modules and memory modules. The ATS-20H-142-C2-R0 is made of a high-grade aluminum alloy that is designed to disperse and dissipate heat quickly and uniformly. The large surface area of the heat sink coupled with its high thermal capacity gives it a high heat transfer rate, which helps to reduce the operating temperature of the component.
The ATS-20H-142-C2-R0 heat sink uses aluminum alloy fins and pins that are precision-machined to optimal tolerances. This ensures that the heat sink can have maximum contact with the component, providing effective heat dissipation. Furthermore, the heat sink has an anodized black finish that increases contact area and improves thermal efficiency. The four mounting holes also provide stability and easy installation.
The working principle of the ATS-20H-142-C2-R0 is based on conduction. For a component to function properly, it needs to dissipate heat in a timely and effective manner. Heat is conducted from the component and spread throughout the surface of the heat sink via a thermal path. The aluminum alloy fins and pins absorb the heat and transfer it to the external environment, thus dissipating the heat. As a result, heat levels are kept under control and the component operates with optimum performance.
In conclusion, the ATS-20H-142-C2-R0 heat sink is designed to provide optimal thermal management for components, such as semiconductors, processors, and power transistors. It uses aluminum alloy fins and pins that are precision-machined to optimal tolerances, providing effective heat dissipation through conduction. Investing in thermal management products such as the ATS-20H-142-C2-R0 allows engineers to design products for better performance and reliable operations.
The specific data is subject to PDF, and the above content is for reference