| Allicdata Part #: | ATS-20H-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-20H-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20H-153-C3-R0 is an advanced thermal-heat sink solution that works to efficiently dissipate the build-up of excessive thermal energy. Heat sinks are commonly used to effectively dissipate the thermal energy in a multitude of applications like semiconductor devices, power supplies, and agricultural machinery. As such, it is important to choose a sink that is able to effectively dissipate your specific thermal needs. The ATS-20H-153-C3-R0 is designed to do just this: quickly and efficiently dissipate thermal energy with the help of its advanced heat sink technology.
The ATS-20H-153-C3-R0 is designed utilizing an advanced air-flow and cooling technology known as “flow-through” cooling. This cooling technology efficiently cools the device through the internal ventilation chamber, allowing air to flow through the heat sink itself. This flow of air is enabled through an array of small fins that are strategically placed on the heat sink at numerous locations. These fins help keep the temperature of the device in check, as the air on the other side of the fins helps carry away the excess heat that builds up.
The ATS-20H-153-C3-R0 is highly compatible with various different applications due to its high range of heat dissipation. It can provide thermal dissipation for a number of electronic devices ranging from LED lights to computers and IT servers. This makes the heat sink an excellent choice for applications in the industries of electronics, information technology, and optoelectronics. The heat sink’s high range of compatibility makes it an ideal choice for any industrial requirement.
The ATS-20H-153-C3-R0 is also made with a unique thermal design, providing an efficient way to transfer the heat to the environment. This design is composed of a variety of materials – such as aluminum and copper – that serve to concentrate the thermal energy. The heat is then dissipated through a series of fins that spread out the heat into the surrounding environment. Through this process, the ATS-20H-153-C3-R0 is able to achieve an extremely low thermal resistance rating, making it a highly efficient solution for effectively exchanging heat.
On top of its advanced cooling technology, the ATS-20H-153-C3-R0 offers a number of features that make it an attractive asset. For example, it is designed with an extra-large heat-exchange area, allowing it to handle large volumes of air with maximum efficiency. Furthermore, this heat sink is designed with a sturdy and durable construction, so it will remain reliable for many years.
The ATS-20H-153-C3-R0 is an ideal solution for efficiently dissipating thermal energy in various applications. Thanks to its advanced flow-through cooling technology, the heat sink offers superior thermal performance and is highly compatible with a wide range of electronics and IT-oriented devices. The heat sink is designed with a large heat exchange area, a strong and durable construction, and a low thermal resistance rating.
The specific data is subject to PDF, and the above content is for reference