| Allicdata Part #: | ATS-20H-161-C3-R0-ND |
| Manufacturer Part#: |
ATS-20H-161-C3-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-161-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of many different types of applications, and this includes the components used to control the heat generated by a device. The ATS-20H-161-C3-R0 thermal heat sink is particularly designed to dissipate large amounts of heat generated by electronic components, ensuring that they do not overheat or suffer consequential damage or malfunction. This article will discuss the application fields and working principle of this thermal heat sink.
Application Fields of ATS-20H-161-C3-R0
ATS-20H-161-C3-R0 thermal heat sinks are typically used in applications that require a high power output but have to fit in a limited space. This makes them ideal for applications such as CPU cooler, LED, and power electronics cooling. The sink installs easily and adjusts thermal balance according to the needs of the components. It is also suitable for direct attachment to circuit boards or other electronic components. Furthermore, the sink can be used in multiple configurations to suit many different platforms.
This thermal heat sink is suitable for a wide variety of commercial and industrial applications, such as computers, servers, and telecom equipment. It has also been used in medical and laboratory equipment, as well as consumer electronics and other heat-generating equipment.
Working Principle
The ATS-20H-161-C3-R0 thermal heat sink utilizes the natural cooling process of convection and conduction. The sink is constructed from an aluminum alloy and provides excellent heat transfer. Heat is transferred from the hottest parts of the system to the cooler parts by conduction, or by transferring heat from one material to another. This is called conduction. Heat is then moved away from the component by convection, where air or liquid carries the heat away.
The design of the thermal heat sink allows for air to flow freely around the component, increasing the thermal transfer rate while also reducing the need for additional fans or other cooling solutions. Additionally, the sink features fins and hollow pipes that help to increase the surface area for heat dissipation. The fins also help to dissipate the heat faster by changing the direction of the air flow, which allows the heat to be dispersed even more quickly and evenly.
The ATS-20H-161-C3-R0 is designed to provide the best solution for cooling components in tight spaces, such as consumer electronics and medical equipment. The high-efficiency design and high-power output provide improved cooling and thermal balance for a variety of applications. The aluminum alloy construction ensures that the thermal heat sink will last for a long time and provide reliable performance.
The specific data is subject to PDF, and the above content is for reference