ATS-20H-170-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-20H-170-C2-R0 is a type of thermal management device which is often used in applications that require efficient heat removal for electronic components. This device is capable of reducing the temperature of electronic components over 30%. This type of thermal management product can be found in various applications that require dependable and efficient cooling solutions.

Features of ATS-20H-170-C2-R0

The ATS-20H-170-C2-R0 is a high performance thermal management device designed to offer reliable heat removal for applications such as processors, CPUs, FPGAs, ASICs, power controllers, and others. It features a heatsink base made from aluminum alloy that provides exceptional thermal conductivity and heat transfer efficiency. The device also includes an internal baffle which helps to spread the heat evenly across the heatsink base. The ATS-20H-170-C2-R0 also boasts a fin stack with 72 fins which help to dissipate heat more efficiently. Furthermore, this device features an optional fan which helps to improve the cooling performance even further.

Applications of ATS-20H-170-C2-R0

The ATS-20H-170-C2-R0 is primarily used in various electronics applications that require dependable and efficient cooling solutions. It is often used in high-powered systems such as servers, mobile phones, gaming consoles, and other electronic devices. It is also suitable for use in medical equipment, robotics, telecommunications equipment, and other advanced technology applications. In addition, it is also used in the automotive industry for controlling temperatures in various automotive components.

Working Principle of ATS-20H-170-C2-R0

The ATS-20H-170-C2-R0’s working principle is based on the transfer of heat from the electronic components to the base of the heatsink. The internal baffle helps to spread the heat evenly across the base, while the 72 fin stack dissipates the heat more efficiently. The optional fan, if present, helps to further improve the cooling performance by increasing the airflow through the heatsink. The thermal management device works by slowly and steadily transferring heat away from the electronic components, resulting in a decrease in the temperature of the components.

Conclusion

The ATS-20H-170-C2-R0 is an effective thermal management device which is used in a variety of applications. Its aluminum alloy base and fin stack provides exceptional thermal conductivity and heat transfer efficiency, while the optional fan helps to further improve its cooling performance. The ATS-20H-170-C2-R0 is suitable for use in servers, mobile phones, gaming consoles, medical equipment, robotics, telecommunications equipment, and other devices that require efficient and reliable heat removal.

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