ATS-20H-181-C3-R0

Heat sinks are devices that dissipate heat from one spot to another. They work by transferring heat from a component or assembly to the surrounding environment using a material of higher thermal conductivity. ATS-20H-181-C3-R0 is a type of heat sink that combines a variety of design elements to provide superior heat dissipation performance. This article describes the application field and working principle of ATS-20H-181-C3-R0.

Application Field

ATS-20H-181-C3-R0 is a type of heat sink designed to dissipate heat from the back of CPUs in computers, servers, and edge computing devices. It is an optimized thermal solution for high-end embedded server and storage systems, as well as other electronic devices. The device is characterized by a unique fin design, providing an increased total contact area for improved heat dissipation performance. In addition, its seamless copper base ensures the best possible heat transfer from the source to be dissipated.

The heat sinks are available in a variety of sizes and configurations, making them ideal for applications with tight space constraints. Furthermore, the aircraft-grade aluminum fins and frame provide superior mechanical strength and extended life expectancy.

Working Principle

The working principle of ATS-20H-181-C3-R0 can be broken down into three parts: conduction, convection, and radiation. Conduction is the transfer of heat from a hot material to a cold material, and the ATS-20H-181-C3-R0 heatsink is designed to take full advantage of this mechanism. The design features a large and thin copper base plate, which is highly thermally conductive and guarantees the maximum possible heat transfer from the source to be dissipated.

Convection is the transfer of heat between hot and cold air layers through circulation, and the design of ATS-20H-181-C3-R0 takes full advantage of this as well. The fins of the heatsink are arranged in such a way as to maximize air circulation and ensure that heat is not trapped inside the device. In addition, the copper base ensures that the heat generated is quickly and efficiently distributed to the surrounding air.

The last primary mechanism of heat transfer is radiation. The aluminum fins of the ATS-20H-181-C3-R0 heat sink are designed to quickly dissipate the heat to the surrounding environment through radiation. The construction of the fins allows them to release heat rapidly, cooling the device down extremely quickly.

Conclusion

ATS-20H-181-C3-R0 is a type of heat sink designed to dissipate heat from the back of CPUs in computers, servers, and edge computing devices. This device combines a variety of design elements to provide superior heat dissipation performance. The heat sink utilizes three primary mechanisms of heat transfer: conduction, convection, and radiation. The design features a large and thin copper base plate, air circulation through the fins, and quick heat dissipation through aluminum fins. ATS-20H-181-C3-R0 is an ideal thermal solution for high-end embedded server and storage systems, as well as other electronic devices.