| Allicdata Part #: | ATS-20H-183-C1-R0-ND |
| Manufacturer Part#: |
ATS-20H-183-C1-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-183-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.34°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are widely used to cool electrical components, chips, and other objects. As electronic components become smaller and more power-hungry, they generate more heat, making heat sinks an integral part of the cooling process. The ATS-20H-183-C1-R0 is a thermal heat sink that works through a convection cooling process to dissipate heat away from the cooling object. This article will explore the application field and working principle of the ATS-20H-183-C1-R0.
Application field
The ATS-20H-183-C1-R0 is designed for a wide range of cooling applications, including electrical components, chips, microprocessors, power transistors, and other heat-generating or temperature-sensitive objects. It can also be used to help cool computer processor chips, as well as other components that require specific temperature control. Its versatile design makes it suitable for cooling object surfaces in tight spaces. Additionally, it can be used in applications where a large amount of heat needs to be dissipated quickly, such as high-performance computers.
Working Principle
The ATS-20H-183-C1-R0 works through a convection cooling process. This involves the object to be cooled being placed in direct contact with a cooling fin. As the cooling fin warms up, the heat is drawn away from the object, allowing it to remain at a relatively cool temperature. This passive cooling process works with air and fan systems, as well as water, making it a versatile cooling system for any application.
The ATS-20H-183-C1-R0 is designed with a finned aluminum top with an exposed copper base. This combination of materials ensures maximum efficiency and heat dissipation. The fins are designed to optimize airflow, providing an even distribution of air over the cooling fin. This optimizes heat transfer, allowing the ATS-20H-183-C1-R0 to dissipate heat effectively and efficiently.
Conclusion
The ATS-20H-183-C1-R0 is an efficient thermal heat sink designed to provide an effective cooling solution for a wide range of applications. Its combination of materials and finned design allows it to dissipate heat quickly and evenly, making it ideal for cooling sensitive objects, microprocessors, and other temperature-sensitive electronic components. If your project requires efficient and effective heat dissipation, the ATS-20H-183-C1-R0 is the perfect solution.
The specific data is subject to PDF, and the above content is for reference