| Allicdata Part #: | ATS-20H-200-C1-R0-ND |
| Manufacturer Part#: |
ATS-20H-200-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-200-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal or heat sinks are materials that are designed to easily dissipate into the atmosphere any heat that is generated by various components such as electrical and electronic components, cooling systems, and thermoelectric cooling devices. Heat sinks effectively absorb and dissipate thermal energy. Thermal energy is generated by an electronic device or component when it is operating, and heat will accumulate during operation. Thermal or heat sinks are designed to absorb and dissipate the heat as quickly as possible. The ATS-20H-200-C1-R0 is a thermal-material heat sink that, when properly deployed, can effectively dissipate thermal energy away from the component it is protecting and into the atmosphere.
The ATS-20H-200-C1-R0 is a heatsink with a high thermal conductivity of 0.4 W/m-K and a low thermal resistance of 0.35 ℃/W. It is a low-cost solution for applications where a 25 x 25x0.75 mm heat sink is required. It is an aluminum heatsink with a 0.2 mm thickness, which helps keep the overall weight and size of the sink low. It has a natural anodized finish for enhanced thermal and electrical conductivity, and it is epoxy-bonded in the factory for additional protection. It also comes with an enabling clip that allows for an easy, secure installation.
The ATS-20H-200-C1-R0 can be used in various fields such as electronic systems, power conversion systems, LEDs, sensors, and switches. This type of heat sink can also be used in a variety of applications such as cooling CPUs, cooling graphics cards, and regulating temperatures in amplifiers and other heat-generating components. The heat sink is also suitable for thermal management of applications such as automotive intercooler systems and power modules.
The ATS-20H-200-C1-R0 works on the basic principle of convection. When the heat sink is exposed to the ambient air, air is drawn across the surface of the heat sink. The air absorbs heat from the surface of the heat sink and convects the heat away from the sink and into the atmosphere. The heat sink is designed with fins that are configured in a way to maximize the surface area and create air turbulence, which helps to further increase the heat transfer. With passive convection, the ATS-20H-200-C1-R0 can achieve relatively high thermal performance.
The ATS-20H-200-C1-R0 is a low-cost, high-performance heat sink that is easy to install and can provide effective thermal management for a variety of applications. Its high thermal conductivity and low thermal resistance make it an ideal choice for applications where a small footprint and superior heat dissipation are required.
The specific data is subject to PDF, and the above content is for reference