| Allicdata Part #: | ATS-20H-39-C1-R0-ND |
| Manufacturer Part#: |
ATS-20H-39-C1-R0 |
| Price: | $ 5.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-39-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.93920 |
| 30 +: | $ 4.66473 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management device designed to transfer excess heat away from sensitive components like processors, transistors, or integrated circuits. The ATS-20H-39-C1-R0 is an example of one such device.
The ATS-20H-39-C1-R0 is a passive heat sink made from aluminum alloy designed to remove heat from circuits operating at low to moderate temperatures. It utilizes a unique fin design to maximize the surface area of the device for better heat transfer, and the fins are connected through a metal bridge for increased rigidity. The ATS-20H-39-C1-R0 has a thermal resistance of 0.2°C/W, which makes it an ideal choice for applications that need efficient heat transfer.
The ATS-20H-39-C1-R0 is mainly used in computers and other electronic devices. It can be used to cool processors, transistors, and other components that generate large amounts of heat. It is also used to protect sensitive components from damage caused by overheating. The ATS-20H-39-C1-R0 is designed with an efficient fin design, which increases the surface area of the device and provides more efficient heat transfer. This makes it an ideal choice for applications that require low thermal resistance.
The working principle of the ATS-20H-39-C1-R0 is relatively simple. Heat generated by the component is dissipated through a series of thermally conductive fins that are connected to a metal bridge. The fins absorb heat from the component and transfer it to the thermal bridge. The bridge then dissipates the heat by convecting it away from the device. Since the fins are made of aluminum, the heat is able to dissipate quickly and the device will remain cool even at high temperatures.
In conclusion, the ATS-20H-39-C1-R0 is a versatile and reliable heat sink that is perfect for cooling processors, transistors, and other sensitive components. It is designed with a thermally conductive aluminum alloy and efficient fin design to ensure maximum heat transfer. With a thermal resistance of 0.2°C/W, it is an ideal choice for applications that require efficient cooling solutions.
The specific data is subject to PDF, and the above content is for reference