ATS-20H-64-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-20H-64-C3-R0-ND

Manufacturer Part#:

ATS-20H-64-C3-R0

Price: $ 4.35
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-20H-64-C3-R0 datasheetATS-20H-64-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.92112
30 +: $ 3.70335
50 +: $ 3.48541
100 +: $ 3.26762
250 +: $ 3.04978
500 +: $ 2.83194
1000 +: $ 2.77748
Stock 1000Can Ship Immediately
$ 4.35
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.49°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Application Field and Working Principle of ATS-20H-64-C3-R0 Thermal - Heat Sinks

Heat sinks are used in a variety of applications and are highly effective at dissipating heat away from components. Specifically, ATS-20H-64-C3-R0 thermal-heat sink assemblies are typically used in microprocessors, LEDs, and other types of integrated circuits. These devices are designed to facilitate high current applications, minimize space requirements, and increase power efficiency.Before diving into the working mechanism of the ATS-20H-64-C3-R0 thermal-heat sink, it is important to first understand the basic principles of how heat is dissipated from electronic components. Heat is generated as electricity passes through components and is typically dissipated by either convection (the transfer of heat by air molecules) or conduction (the transfer of heat through material). As a result, these two methods, when combined in a heat sink, are both used for heat dissipation.When it comes to the ATS-20H-64-C3-R0 thermal-heat sink, the heat is primarily dissipated by conduction, coupled with a small amount of convection. The ATS-20H-64-C3-R0 features a base aluminum body with a copper heat plate, providing a high thermal conductivity of up to 4600 W/mK. This base design should allow for the device to maintain a low temperature while dissipating heat away from the components. Additionally, the ATS-20H-64-C3-R0 utilizes a cleverly designed fin array that offers a low-pressure drop while still providing a large surface area for heat dissipation. The fin array is also designed to minimise turbulent airflow, further increasing the efficiency of thermal transfer, allowing the device to work at peak performance.When the ATS-20H-64-C3-R0 thermal-heat sink is in operation, the base aluminum body with a copper heat plate will absorb heat from the components. This heat is then transferred to the fin array by conduction. The fins will then dissipate the majority of the heat away from the components by convection, meaning that the air molecules surrounding the fins will absorb heat away from the fin and then be replaced by new air molecules at a lower temperature, thus cooling the components.The ATS-20H-64-C3-R0 thermal-heat sink is designed to maintain a low temperature under high current applications and it is a perfect fit for any high performance system. It\'s low-pressure drop fin array allows for high levels of heat dissipation and it\'s base aluminum body and copper heat plate ensure efficient thermal transfer. This combination of features makes the ATS-20H-64-C3-R0 thermal-heat sink a great choice for heat dissipation applications in a variety of electronic components including microprocessors, LEDs, and other types of integrated circuits.

The specific data is subject to PDF, and the above content is for reference

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