| Allicdata Part #: | ATS-20H-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-20H-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-20H-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-20H-65-C3-R0 is a high performance thermal device, commonly known as a heat sink, designed to transfer heat away from high temperature components. This heat sink is specifically designed for use in serious applications, particularly those that require very long operating lifetimes and maximum cooling efficiency. To ensure high performance, the ATS-20H-65-C3-R0 is manufactured using solid copper as the heat-conducting material.
A heat sink works by dissipating heat away from components by convection, radiation or both. This process occurs when a heat source, such as a laptop processor, dissipates energy as heat and the heat sink absorbs and dissipates it away. The chief design objective of a heat sink is to improve the maximum allowable temperature of a device by transferring heat away from it as efficiently as possible. This serves to guarantee both improved device performance and extended its lifetime.
The ATS-20H-65-C3-R0 has an extremely efficient heat dissipation capability. This is because copper is an excellent conductor of heat,causing it to spread heat quickly and efficiently. In addition, the heat sink features a wide, flat surface that increases the surface area of the device and disperses the heat more efficiently. The ATS-20H-65-C3-R0 also contains a finned design to further increase its cooling efficiency. This type of heat sink includes a large number of small fins attached to the base, allowing it to dissipate heat even more quickly by creating air pockets which expand heat away from the device.
The ATS-20H-65-C3-R0 is suitable for a variety of applications,including laptop motherboards and computer cards. Its wide, flat surface and efficient heat dissipation capability make the ATS-20H-65-C3-R0 ideal for large and complex components that produce a large amount of heat during operation. Its low weight and compact design also makes it ideal for applications where space is limited or components require external cooling. By using quality materials, the device is able to withstand high temperatures and still maintain its structural integrity.
In conclusion, the ATS-20H-65-C3-R0 is a high performance thermal device designed to transfer heat away from high temperature components. Its copper construction, wide surface area and finned design allow it to dissipate heat quickly and efficiently, making it ideal for a range of applications. Furthermore, the device is lightweight and compact, making it easy to install and use in applications where space is limited.
The specific data is subject to PDF, and the above content is for reference