ATS-20H-80-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	19.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-20H-80-C2-R0 Application Field and Working Principle

Heat sinks are a vital component of modern day electronics. These are designed to transfer heat from electronic devices to the external environment at a quicker rate than other means. The ability to rapidly remove heat from intricate electronic components helps to minimize their internal temperatures and, in turn, reduce the instances of overheating. In this article, we will discuss the application field and working principle of the ATS-20H-80-C2-R0 heat sink, which is a product of the well-known American manufacturer, Aeroflex Thermal Systems. This device is made from high-grade aluminum and is designed to provide superior cooling of delicate electronic components that require higher than normal thermal management solutions. The ATS-20H-80-C2-R0 heat sink is designed for a variety of electronics with different application fields, including telecommunications, medical, industrial automation, computers, gaming systems, and many other related electronic systems. This device is recommended for medium-sized electronic components that generate moderate to high levels of heat. The maximum ambient temperature that the device is designed to handle varies, depending on both the component requirements and the environmental conditions in the specific application field. It can handle ambient temperatures ranging from 0°C to 60°C. The ATS-20H-80-C2-R0 is constructed using Aeroflex Thermal Systems’ proprietary technology that utilizes the principles of thermal conductivity and conduction to create a device that efficiently transfers heat away from the electronic components.Thermal conduction is the process of distributing generated thermal energy from one surface to another by direct contact and is achieved by the ATS-20H-80-C2-R0 by the use of a proprietary heat pipe. This heat pipe comprises two parts, an internal heat transport section and an external heat spreader section, connected to each other via a connector modeled after an electric screwdriver. The internal heat transport section of the heat pipe is made of high thermal conductive material with a low thermal resistance. The heat pipe properties allow for efficient thermal conductivity, while the internal heat transport section of the device creates a conduction path from the heat source to the external heat spreader section, which is composed of a set of machined fin blades designed for optimal cooling performance. The external heat spreader section of the device ensures that the energy produced by the electronic component is spread throughout the fin blades of the device and ultimately dissipates into the atmosphere. The ATS-20H-80-C2-R0 heat sink is supplied in a pre-assembled form, which makes the installation process simple and easy. This device is also designed for easy maintenance, enabling the user to remove the fin blades and heat pipe via the connector and reinstall them without any complications.The ATS-20H-80-C2-R0 heat sink is a reliable and efficient device designed to provide superior cooling performance for a variety of electronics, ensuring that electronic components are able to function optimally in an environment with high ambient temperatures. Its various features, including the proprietary heat pipe technology, fin blades, and pre-assembled form, make it an ideal solution for a variety of applications.

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