| Allicdata Part #: | ATS-21A-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-21A-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is one of the most important aspects of electronics design. Properly designed heat sinks are required to dissipate the heat generated by the electronic components and keep them within a safe operating temperature range. The ATS-21A-110-C3-R1 Heat Sink is a popular choice for managing electronic components and keeping them cool. In this article, we will discuss the application field and working principle of the ATS-21A-110-C3-R1 Heat Sink.
The ATS-21A-110-C3-R1 Heat Sink is a compact, high-performance heat sink designed to effectively dissipate large amounts of heat generated by electronic components. The ATS-21A-110-C3-R1 features a large number of fins that increase the surface area of the heat sink, thus allowing for greater heat transfer. The fin design of the ATS-21A-110-C3-R1 is carefully calculated to increase surface area while also increasing airflow in order to maximize heat dissipation. In addition to the fin design, the ATS-21A-110-C3-R1 features a built-in fan to increase the cooling power of the heat sink.
The ATS-21A-110-C3-R1 Heat Sink is suitable for a wide range of applications. It is commonly used in telecommunications systems, power supplies, gaming consoles, data storage systems, and HDDs. It is also used in other applications such as military and aerospace electronics, automotive electronics, medical electronics, and process control systems. The combination of fin design and fan makes the ATS-21A-110-C3-R1 an ideal choice for applications where large amounts of heat need to be dissipated quickly and efficiently.
The working principle of the ATS-21A-110-C3-R1 Heat Sink is quite simple. During operation, heat generated by the electronic components is conducted to the heat sink via a thermal interface material. The fins of the heat sink then disperse the heat to the surrounding air and the fan helps to improve the cooling performance. The operation of the fan is controlled by an integrated temperature controller, which can be adjusted to meet the cooling requirements of specific components.
In conclusion, the ATS-21A-110-C3-R1 Heat Sink is an effective solution for thermal management of electronic components. It combines a large surface area and a built-in fan to provide superior heat dissipation and cooling performance. The ATS-21A-110-C3-R1 is suitable for a wide range of applications and is an excellent choice for high-performance applications where keeping electronics cool is critical.
The specific data is subject to PDF, and the above content is for reference