ATS-21A-113-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS34345-ND

Manufacturer Part#:

ATS-21A-113-C2-R0

Price: $ 3.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21A-113-C2-R0 datasheetATS-21A-113-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.20040
10 +: $ 3.11472
25 +: $ 3.03055
50 +: $ 2.86209
100 +: $ 2.69375
250 +: $ 2.52542
500 +: $ 2.44124
1000 +: $ 2.18870
Stock 1000Can Ship Immediately
$ 3.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.79°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is critical for most electronic applications to ensure the circuit board and electronic components remain within a temperature range that allows them to properly function. The ATS-21A-113-C2-R0 Thermal-Heat Sink is an efficient electronic cooling device designed to meet thermal management requirements for a wide variety of applications, from automotive electronics to consumer appliances. This section will discuss the ATS-21A-113-C2-R0 thermal-heat sink, its application fields, and its working principle.

Application Field of ATS-21A-113-C2-R0 Thermal-Heat Sink

The ATS-21A-113-C2-R0 is an ideal solution for thermal management requirements in a wide range of applications, from automotive to consumer electronics. It has a high power dissipation capability, low thermal resistance, and wide operating temperature range, making it perfect for many types of consumer or industrial applications. Additionally, it is especially suited for high current charge pump circuits, and SMPS (switched-mode power supplies) control ICs, making it attractive for applications in home appliances, battery powered systems, computers, medical devices, and other electronics.

Working Principle of ATS-21A-113-C2-R0 Thermal-Heat Sink

The ATS-21A-113-C2-R0 works best when used in conjunction with a fan or blower, although it can also be used without one. In either case, the thermal-heat sink and fan(s) provide air flow over the electronic components, allowing them to properly dissipate thermal energy. Additionally, the fan or blower increases the air flow rate, providing even more efficient cooling. The thermal-heat sink is attached to the component to be cooled, while the fan directs air over the component, providing a continuously moving supply of cool air over the component.

The ATS-21A-113-C2-R0 thermal-heat sink is designed to maximize cooling efficiency. It has a curved interior surface to reduce air turbulence, while its low thermal resistance ensures a stable temperature. Additionally, the thermal-heat sink has a low contact resistance, which allows heat to quickly transfer from the component to the airflow, resulting in more efficient cooling. The ATS-21A-113-C2-R0 is also designed to be robust and reliable, with a die-cast aluminum construction, thick metal walls, and a sturdy mounting bracket.

Conclusion

The ATS-21A-113-C2-R0 Thermal-Heat Sink is a reliable and efficient thermal management device. It is designed for use in a wide range of applications, from automotive to consumer electronics, and it is especially suited for applications with high current charge pump circuits or SMPS control ICs. The ATS-21A-113-C2-R0 works best when used with a fan or blower, although it can also be used without one. It has a curve interior surface to reduce air turbulence, a low contact resistance to help transfer heat away from the component, and a robust mounting bracket to ensure stability. With its efficient cooling capability, the ATS-21A-113-C2-R0 thermal-heat sink is the ideal choice for efficient thermal management requirements.

The specific data is subject to PDF, and the above content is for reference

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