| Allicdata Part #: | ATS34372-ND |
| Manufacturer Part#: |
ATS-21A-138-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-138-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components for many electronic devices. They allow heat to dissipate quickly and efficiently from electronic components, helping to ensure the longevity and reliability of the device. The ATS-21A-138-C2-R0 thermal heat sink is a highly advanced and efficient unit designed for use in a variety of electronic applications.
The ATS-21A-138-C2-R0 is a large two-stage heat sink. It is constructed with a large finned heat sink, which increases the surface area for heat transfer. The heat sink has an adjustable fan control, allowing users to adjust the speed of the cooling fan to meet the specific application requirements. ATS-21A-138-C2-R0 also include an encapsulated spring-loaded heatsink and thermal epoxy, both of which ensure a tight seal of the heat sink against the component device.
The main application field for the ATS-21A-138-C2-R0 thermal heat sink is in chip-level electronics. This includes microprocessors, digital signal processors, embedded controllers, power microchips, memory chips, etc. These types of electronic components generate excess heat during operation. The ATS-21A-138-C2-R0 thermal heat sink is designed to effectively dissipate this heat from the component, in order to maintain reliable, safe, and consistent temperatures during operation.
The working principle of the ATS-21A-138-C2-R0 heat sink is very simple. When a chip is in operation, the heat generated by the device will be passed through the heatsink fins. The fins increase the surface area of the heat transfer, allowing for the heat energy to be dissipated at a faster rate. The fan then blows the hot air away from the heatsink, cooling down the component. This process helps keep the component operating at stable temperatures, preventing any overheating, burned out components, or device failure.
The ATS-21A-138-C2-R0 thermal heat sink is a highly efficient and reliable unit. It is well-suited for use in a wide range of chip-level electronic components. The adjustable fan control and thermal epoxy ensure a tight seal between the heatsink and the component, allowing for efficient heat transfer. This increases the longevity and reliability of the device, providing users with the peace of mind that their electronics will remain operating at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference