ATS-21A-195-C1-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-21A-195-C1-R0-ND |
| Manufacturer Part#: |
ATS-21A-195-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-195-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important devices used to effectively manage various kinds of thermal energy. When excessive thermal energy is produced due to electronic applications, a heat sink is used to disperse the energy quickly, preventing the equipment from overheating. The ATS-21A-195-C1-R0 is a type of heat sink designed to provide superior thermal performance for electronic applications.
Performance Characteristics
This device is designed with a robust aluminum structure and a copper base that allows for maximum heat conduction and dissipation. This efficient heat dissipation reduces the temperature of a heated area by up to 50%, allowing for higher performance and increased reliability of electronic components.
In addition, this device provides high speed thermal management through its aerodynamic design which allows for maximum airflow. This improved airflow increases the thermal efficiency of the device by up to 20%, thus reducing the overall temperature of the system.
Application Field
The ATS-21A-195-C1-R0 heat sink is designed for use in a variety of industrial applications such as medical, automotive, and telecommunication. This device is also suitable for a range of electronic devices including laptops, desktops, and servers. Moreover, it can be used in application fields such as Home Appliance, Industrial Equipment, LED Lighting, Telecommunications Equipment and more.
Working Principle
The working principle of the ATS-21A-195-C1-R0 is based on the idea of heat transfer. Heat from the central processor is readily dissipated by the heat sink, as thermal energy is transferred away from the hot components. This is achieved through the aluminum structure and copper base of the device which are effective heat conductors. The heat fin design further improves the overall efficiency by allowing the hot air to come in contact with a larger surface area thus ensuring fast heat transfer.
The efficient design of this heat sink provides for efficient operation, ensuring that the core components of an electronic device remain cool and at optimal performance. Therefore, allowing for extended system life and improved reliability.
Conclusion
The ATS-21A-195-C1-R0 is an efficient and reliable thermal management device which is suitable for various types of electronic applications. The device features a robust aluminum and copper construction and a finned design which allow for effective heat transfer, resulting in a significantly cooler environment. This device is perfect for applications such as medical, automotive, and telecommunication, providing a reliable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference