| Allicdata Part #: | ATS-21A-203-C3-R0-ND |
| Manufacturer Part#: |
ATS-21A-203-C3-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-203-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.04°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
ATS-21A-203-C3-R0 is a Thermal - Heat Sinks widely used in the industrial, medical and automotive sectors. This type of unit is designed to absorb, transfer, and dissipate large quantities of heat generated by computer components, power amplifiers, motors, and auxiliary devices. It is one of the most efficient and cost-effective solutions for cooling high-energy devices and helping keep them from overheating.
Mechanical and Physical Specifications
The ATS-21A-203-C3-R0 has dimensions of 10.5 inches x 4.25 inches x 2.6 inches including the mounting holes, making it suitable for a wide range of applications. It features a die-cast aluminum heatsink base with an anodized aluminum fins, and is equipped with a highly efficient radial fan that can generate up to 19 dba of noise. The heat sink also features an anodized aluminum fins top which has an effective area of 13.5 square inches.
Installation Process
Installation of the ATS-21A-203-C3-R0 is relatively simple for most applications. The heatsink should be mounted on the device that is to be cooled, such as a CPU or power amplifier, using the included mounting hardware. The heatsink should be properly aligned over the heat generating device so that the fins of the heat sink are exposed to the air flow. It is important to ensure that the fins of the heatsink are facing the air flow in order to maximize the efficiency of the cooling system.
Application Fields and Working Principle
The ATS-21A-203-C3-R0 is usually utilized to provide cooling for CPU’s, high-power amplifiers, and other heat generating devices. In order to ensure optimal thermal performance, the air flow must be directed to the device being cooled with the help of the heatsink. The heat sink then absorbs, transfers, and dissipates the heat generated by the device. This process of thermal energy transfer helps keep the device from overheating.
Conclusion
ATS-21A-203-C3-R0 Thermal - Heat Sinks is an effective and cost-efficient solution for cooling high-energy devices. By efficiently absorbing, transferring, and dissipating large amounts of heat generated by computer components, power amplifiers, and other auxiliary devices, these units help to extend the life of the device while providing optimal temperature performance. Proper installation and alignment is important in order to maximize the efficiency of the device, however the easy installation and setup make it possible to maximize thermal performance without technical experience or extensive hardware knowledge.
The specific data is subject to PDF, and the above content is for reference