ATS-21A-25-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21A-25-C3-R0-ND

Manufacturer Part#:

ATS-21A-25-C3-R0

Price: $ 5.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21A-25-C3-R0 datasheetATS-21A-25-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.11245
30 +: $ 4.82853
50 +: $ 4.54444
100 +: $ 4.26044
250 +: $ 3.97641
500 +: $ 3.69238
1000 +: $ 3.62137
Stock 1000Can Ship Immediately
$ 5.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are important components for controlling thermal-electronic processes. ATS-21A-25-C3-R0 is a new type of thermal heat sink that makes up part of an innovative new technology for dissipating large amounts of heat. In this article we’ll explore the application field and working principle of ATS-21A-25-C3-R0.

The ATS-21A-25-C3-R0 is designed for use in many different types of applications. Many manufacturers are using it as part of their cooling system designs. The versatile design of the ATS-21A-25-C3-R0 thermal heat sink allows it to be used in many different contexts, including applications in industrial, automotive and military sectors.

The ATS-21A-25-C3-R0 is designed to be able to dissipate large amounts of energy. The reason for this is its unique design, which takes advantage of the conduction, radiation and convection cooling techniques. The purpose of these techniques is to ensure that the heat from electronic components can be quickly and effectively dissipated. It is also designed to be used in a variety of different applications, including those applications where it needs to operate in high temperatures.

The ATS-21A-25-C3-R0 thermal heat sink is also designed to be able to handle very large amounts of heat. In order to achieve this, it uses advanced materials and techniques. This includes using aluminum and other specialized metals in order to absorb the heat and also using heat sinks which are shaped in a specific way to ensure the heat is evenly spread throughout the entire surface area. In order to improve the efficiency of the ATS-21A-25-C3-R0, it is also designed to take advantage of multiple-layer insulation techniques.

In order to use the ATS-21A-25-C3-R0 effectively, the heat needs to be evenly distributed throughout the system. This is done by using a combination of convection, conduction and radiation. Convection cooling uses air movement to dissipate heat from the source. This is done by passing hot air over the heat source and out into the surrounding atmosphere. Conduction cooling uses direct contact between the component and the heat source to transfer heat to the heat sink. Radiation cooling uses thermal radiators to dissipate heat into the surrounding air.

In order to improve the efficiency of ATS-21A-25-C3-R0, the system is designed to also take advantage of multiple thermal management techniques. These include thermal room temperature control, active cooling and fan control. By using the combination of these techniques, ATS-21A-25-C3-R0 is designed to provide an efficient and effective cooling solution for many different types of applications.

The ATS-21A-25-C3-R0 thermal heat sink is a great choice for many different applications. It is designed to be very effective at dissipating large amounts of heat and is designed to be able to handle the high temperatures associated with many industrial applications. It is also designed to be able to take advantage of multiple-layer insulation techniques in order to increase the efficiency of the system. By using these techniques, the ATS-21A-25-C3-R0 is able to provide a reliable and efficient cooling solution for many different types of applications.

The specific data is subject to PDF, and the above content is for reference

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