ATS-21A-33-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal – Heat Sinks: ATS-21A-33-C1-R0 Application Field and Working Principle

Computers, electronics, and other devices used in daily life workload heavily rely on efficient cooling techniques to prevent over-heating and damage. To manage high-temperatures, ATS-21A-33-C1-R0 thermal – heat sinks are used as a solution. These heatsinks work by dissipating heat away from the device and temperatures are able to remain relatively low. In this article, the application field and working principle of the ATS-21A-33-C1-R0 thermal – heat sinks will be discussed. OTS-21A-33-C1-R0 thermal – heat sinks are applicable in high-end industrial cooling systems, desktop computers, servers, as well as electronic components. These heatsinks are made from aluminum and use fins as the main support along with a baseplate serving as the foundation. This combination of metal and fins works to maximize the surface area of the heatsink and allows for more efficient cooling. Heat generated by a device is absorbed by the heatsink and conducted away from the device into the surrounding environment.The design of the ATS-21A-33-C1-R0 thermal – heat sinks includes the thermoelectric fan for cooling after absorbing heat. The fan works by drawing in the hot air around the heat source and expeling the air out of the heat sink, allowing for maximum cooling. This fan also helps circulate air and cool other parts of the device, such as the memory and processor. In addition to the thermoelectric fan, the ATS-21A-33-C1-R0 thermal – heat sinks have a durable copper base section. The copper base absorbs and redistributes the heat from the device more evenly than aluminum. This allows for more efficient cooling and reduces stress on the system and parts.The final component of the ATS-21A-33-C1-R0 thermal – heat sinks are the individual fins that make up the side panels. The fins are designed to increase the surface area of the heatsink and thus, increase the rate of heat absorption. The increased surface area also increases the rate of dissipation, thus, improving the efficiency of the cooling process. Each of the fins come in a variety of shapes and sizes to fit the requirements of the device, such as memory modules, processors, laptops, etc. To conclude, the ATS-21A-33-C1-R0 thermal – heat sinks are designed to provide efficient cooling and reduce device temperatures. The combination of the fan, copper base, and fins work together to improve airflow and absorb heat from the device more quickly. This allows for more reliable and stable performance in electronics and other high-end applications.

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