| Allicdata Part #: | ATS-21A-36-C2-R0-ND |
| Manufacturer Part#: |
ATS-21A-36-C2-R0 |
| Price: | $ 5.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-36-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.23971 |
| 30 +: | $ 4.94865 |
| 50 +: | $ 4.65759 |
| 100 +: | $ 4.36647 |
| 250 +: | $ 4.07537 |
| 500 +: | $ 3.78427 |
| 1000 +: | $ 3.71150 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are vital components of any electronic device, as they help to dissipate excessive heat generated by the device’s electronic components. The ATS-21A-36-C2-R0 is a significant example of a thermal heatsink that can be used in a wide range of applications. This article will discuss the application field and working principle of the ATS-21A-36-C2-R0 thermal heatsink.
The ATS-21A-36-C2-R0 is designed for use in applications where it is necessary to dissipate up to 36 Watts in a confined space, such as microprocessors or power transistors. It can also be used in LED applications where thermal management is of particular importance. Due to its compact size, it is suitable for use in applications where space is at a premium, including embedded systems. This thermal heatsink is especially popular with PC motherboard applications, due to its superior performance.
The ATS-21A-36-C2-R0 is constructed of high quality thermally conductive aluminum alloy. This aluminum alloy is capable of dissipating heat quickly and with great efficiency, making it ideal for applications in which thermal performance is a priority. The heatsink is also designed with an extruded fin design, which helps to increase its surface area and thus its overall heat dissipation capability. This design also allows for remarkable air flow, ensuring that the heatsink remains cool even at maximum loads.
In addition to its superior thermal performance, the ATS-21A-36-C2-R0 also uses a unique mechanism for heat dissipation. This mechanism is known as “thermal conduction”. Thermal conduction works by transferring heat away from the heat-generating component and into the heatsink, where it is dissipated into the surrounding atmosphere. This process is facilitated by the direct contact between the heatsink and the heat-generating component, as well as the thermal interface material, which allows heat to be transferred more quickly and efficiently.
The ATS-21A-36-C2-R0 is a highly-efficient thermal heatsink that can be used in a wide variety of applications where heat dissipation is of utmost importance. Its compact size and advanced thermal conduction technology make it an ideal choice for those looking to reduce the overall volume of their electronic equipment while still providing superior thermal performance. With its extended fin design and robust construction, the ATS-21A-36-C2-R0 is sure to provide superior thermal protection for any electronic device.
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