ATS-21A-40-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-21A-40-C3-R0-ND

Manufacturer Part#:

ATS-21A-40-C3-R0

Price: $ 6.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X11.43MM T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21A-40-C3-R0 datasheetATS-21A-40-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.76009
30 +: $ 5.44026
50 +: $ 5.12026
100 +: $ 4.80022
250 +: $ 4.48021
500 +: $ 4.16019
1000 +: $ 4.08019
Stock 1000Can Ship Immediately
$ 6.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.61°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-21A-40-C3-R0 is a thermal product developed for keeping electronic components cool and preventing issues like overheating. The product is part of the thermal-heat sinks category. It is typically used in both commercial and industrial applications. Its innovative design allows it to disperse heat faster and more effectively than its competitors.

The main purpose of ATS-21A-40-C3-R0 thermal-heat sinks is to dissipate the heat of electronics components, like processors, and keep them from overheating. It does this by redirecting heat away from the component while absorbing some of it itself. This allows the component to remain cool and increases its efficiency. In addition, these products are designed to be used in limited space as they have a small footprint.

The ATS-21A-40-C3-R0 thermal-heat sinks use a combination of active and passive cooling systems to dissipate heat. Active cooling involves the use of fans to move air over the component to reduce its temperature. Passive cooling, on the other hand, relies on the materials used in the design to absorb and redirect heat away from the component. The combination of these two cooling methods results in an efficient cooling system that ensures the component remains cool even under heavy loads.

In terms of construction, ATS-21A-40-C3-R0 thermal-heat sinks are typically constructed of metal alloys. The material used in the construction of the product plays a crucial role in its ability to dissipate heat and keep electronics components from overheating. To ensure maximum heat transfer, the working surfaces may be anodized, lined with epoxy, or polished.

While ATS-21A-40-C3-R0 thermal-heat sinks are designed to disperse heat efficiently, it is important to understand that they are not a replacement for active cooling systems. This is because they are only able to reduce the temperature of the component to a certain point; any further cooling may require additional cooling sources, such as fans and other cooling devices.

ATS-21A-40-C3-R0 thermal-heat sinks are a great option for keeping electronics components cool and preventing them from overheating. They are cost-effective, use a combination of cooling methods, and have a small footprint. With proper installation and maintenance, they can provide reliable cooling performance for any application.

The specific data is subject to PDF, and the above content is for reference

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