ATS-21A-73-C1-R0 Fans, Thermal Management |
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| Allicdata Part #: | ATS-21A-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-21A-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are a key element in any electronic system design. They act as a passive component which dissipates heat away from sensitive parts as well as from the surface of contact with other components. The ATS-21A-73-C1-R0 is a thermal sink that is designed, manufactured, and tested to be used with various integrated circuits, power transistors, and other heat-sensitive components.
This thermal sink is mainly constructed of an aluminium alloy, which ensures superior mechanical strength and electrical conductivity. It has a very high heat-dissipation capacity and is self-maintaining since it has a large surface area which mitigates the risk of overheating. Additionally, the thermal sink has a low-profile design which ensures that a large number of components can be fit into the same small space. This allows the thermal sink to be used for a variety of applications in electronics, telecom, automotive, and other industries where devices need to be integrated into a smaller area.
The ATS-21A-73-C1-R0 thermal sink has a reliable performance and is able to dissipate large amounts of heat quickly. Its working principle is straightforward: heat generated from the components is transferred to the large surface area of the sink via convection currents, where it is dissipated away from the component. This process is in turn facilitated by the fin structure of the sink, which increases the surface area available for heat dissipation and enhances the convection current. As the heat is dissipated, the components are able to remain cooler and function better, even under high input power and temperature conditions. Additionally, the fins also function as an effective radiative dissipater, further reinforcing the thermal sink’s ability to dissipate away heat quickly and effectively.
The ATS-21A-73-C1-R0 thermal sink is suitable for a wide range of application fields, including power supplies, DC/DC converters, amplifiers, and other electronic/telecommunication devices. With its reliable performance, low energy consumption, and superior design, this thermal sink offers a great solution for any design engineer looking to achieve better thermal management. It also boasts an excellent cost-performance ratio, making it a great choice for budget-conscious engineers.
To sum up, the ATS-21A-73-C1-R0 thermal sink is a reliable, efficient, and cost-effective solution for any design engineer. Its large surface area, fin design, and low-profile construction make it a great choice for any project that involves thermal management. By dissipating heat quickly and effectively, it can help ensure that the components remain within a safe temperature range and work optimally.
The specific data is subject to PDF, and the above content is for reference