| Allicdata Part #: | ATS34516-ND |
| Manufacturer Part#: |
ATS-21A-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21A-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components in many electronic devices, as they play a vital role in managing the device’s temperature. Without a properly functioning heat sink, the electronic components may overheat and become damaged, leading to costly repairs. The ATS-21A-97-C2-R0 heat sink is specifically designed to meet the demands of modern electronics. This article looks at the application field and working principle of the ATS-21A-97-C2-R0 in detail.
Application Field
The ATS-21A-97-C2-R0 can be used to cool or manage heat in a wide range of applications. These include high-power circuits, industrial controllers, computer servers, and telecommunications systems. It is designed for use in highly-dense, high-heat-emitting applications, where cooling is critical. Its small form factor makes it ideally suited to small-scale applications.
The ATS-21A-97-C2-R0 can also withstand temperatures of up to 165°C. This makes it suitable for applications that generate a lot of heat, such as multicore CPUs, power supplies, and signal converters. Furthermore, its long-term reliable performance means that it can be used in industrial and other demanding environments.
Working Principle
The ATS-21A-97-C2-R0 uses an innovative heat-dissipating design to maximize cooling performance. This design includes a layered structure with high-performance insulators that enable efficient heat release. The layers are created from a combination of low thermal resistance materials, such as aluminum, copper and plastic. The combination ensures thermal stability and a reliable heat transfer.
The design also features a highly efficient cooling channel. This channel allows a maximum amount of the heat to be expelled efficiently while minimizing air turbulence. This ensures a consistently high level of performance regardless of the operating environment.
To maximize efficiency, the ATS-21A-97-C2-R0 features an arched structure that ensures even heat distribution. This reduces the risk of overheating and enhances the performance in higher-temperature applications. The combination of efficient air flow and careful heat distribution ensures the ATS-21A-97-C2-R0 can achieve excellent cooling performance.
Conclusion
The ATS-21A-97-C2-R0 thermal heat sink is designed to meet the demands of modern electronic devices. Its innovative layered structure, efficient cooling channels and careful heat distribution ensures reliable performance in a variety of high-heat-emitting applications, such as multicore CPUs, power supplies and computer servers. Overall, the ATS-21A-97-C2-R0 is a reliable and durable heat sink that is suitable for a wide range of demanding applications.
The specific data is subject to PDF, and the above content is for reference