| Allicdata Part #: | ATS-21B-06-C3-R0-ND |
| Manufacturer Part#: |
ATS-21B-06-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-06-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are devices that are designed to absorb and dissipate heat generated by electronic components. ATS-21B-06-C3-R0 is one such device that has been developed to provide efficient thermal management for the most demanding technical applications.
This device has a unique design which supports a number of features, such as a low profile to accommodate space-constrained applications, integrated pins to help dissipate the generated heat, and a high-temperature resistant aluminum construction. The device also has a high thermal-conductivity rating, allowing it to transfer the heat away from the component quickly and efficiently.
In terms of its working principle, the device works by absorbing heat from the component, dissipating it through its network of integrated pins. It then transfers the heat away from the component and out of the system. This process helps to reduce the overall temperature of the component, ensuring that it remains within the specified threshold.
The device is also designed with thermal sensors that monitor the temperature levels of the component, allowing it to adjust the cooling efficiently. The sensors can detect the ambient temperature and regulate the amount of heat dissipation accordingly. Additionally, the device can be easily integrated into a variety of systems without additional components.
Due to its efficiency, the ATS-21B-06-C3-R0 Thermal-Heat Sink is well suited for use in a variety of applications, including consumer electronics, medical, automotive, military, and aerospace. It is an ideal solution for high-performance components that require reliable and effective thermal management solutions.
The device can also be used in other systems that generate a large amount of heat, such as power supplies, lighting, audio equipment, and industrial machinery. In these cases, the device can help to reduce the temperature of the system and improve its efficiency.
Overall, the ATS-21B-06-C3-R0 Thermal-Heat Sink is an effective way to reduce the component temperature and improve the efficiency of the system. It has been designed and manufactured to the highest standards, providing reliable and efficient performance in the most demanding applications.
The specific data is subject to PDF, and the above content is for reference