| Allicdata Part #: | ATS-21B-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-21B-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component for keeping any device or system from overheating and causing potential damage. The ATS-21B-10-C1-R0 is a special type of heat sink specifically designed to provide enhanced heat transfer.
The ATS-21B-10-C1-R0 is constructed from extruded aluminum. This type of aluminum is designed to have a high thermal conductivity, which means it can quickly transfer heat from one area to another. To help improve the heat transfer, the sink is designed with a specifically engineered slot pattern which provides more exposed points of contact with the air.
The ATS-21B-10-C1-R0\'s design also allows for more efficient cooling. The fin-shape of the heat sink increases the surface area, which gives it a greater capacity to release heat. Additionally, the fin-shape allows air to pass over the sink more uniformly, distributing the temperature more evenly and making it easier for the heat to escape the sink. This efficient cooling capabilities make the ATS-21B-10-C1-R0 suitable for a wide range of applications.
The ATS-21B-10-C1-R0 is a great choice for applications that require efficient heat transfer and cooling. It is commonly used in electronic components like CPUs, DSPs, FPGAs, and memory devices. It can also be used to cool a wide variety of power supplies, including those used in telecommunications, aerospace systems, and automotive applications. Its superior thermal transfer capabilities make it an ideal choice for high-efficiency systems that require consistent temperature control.
In order to be effective, the ATS-21B-10-C1-R0 must be mounted properly. The heat sink should be firmly attached to the component in order to ensure optimal heat transfer. Additionally, it must be installed with a proper thermal interface material in order to maximize the efficiency of heat dissipation.
The ATS-21B-10-C1-R0 heat sink is an effective and efficient way to transfer heat away from a component and help prevent overheating. Its high thermal conductivity, engineered slot pattern, and fin-shaped design make it ideal for a wide range of high-efficiency applications. With proper installation and thermal interface material, the ATS-21B-10-C1-R0 heat sink is sure to keep your components safe and running efficiently for many years to come.
The specific data is subject to PDF, and the above content is for reference