| Allicdata Part #: | ATS-21B-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-21B-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components used in the cooling system of an electronic device. The ATS-21B-117-C1-R0 heat sink, made from high quality aluminum alloy and with a sturdy rectangular metal frame, is designed to draw out the heat generated by a variety of electronic components. The top of the heat sink is designed to be in direct contact with the surface of the component, while the base is secured to a metal heat plate. This heat sink is a good choice for applications that require a high performing thermal module.
The ATS-21B-117-C1-R0 is designed to efficiently dissipate the heat generated by multiple components just like a traditional heat sink. Airflow is crucial for efficient cooling, and the unique design ensures that air can flow easily over the surface of the heat sink and quickly dissipate the heat away from its source. Its highly reflective surfaces maximize air contact to ensure maximum cooling power.
This heat sink also features a two-stage assembly: a finned heatsink and a base plate. The finned heatsink is designed to maximize surface area exposure, which allows for a greater amount of air flow. The base plate is manufactured from highly reflective aluminum alloy that further enhances the efficiency of the heat sink. The combination of the two-stage assembly and high performance metal frame makes this flexible, high-performing, and robust heat sink perfect for a variety of smaller electronic components.
The fins on this ATS-21B-117-C1-R0 are configured to direct air over the finned heat sink. This allows the heat to be more efficiently spread to the surrounding air. The design also ensures that all of the components are in direct contact with the heat sink, allowing the heat to be dissipated more evenly and efficiently. The base plate is also designed for maximum air contact, ensuring that the heat generated by the components is spread evenly and dissipated quickly.
The ATS-21B-117-C1-R0 is a good choice for applications that require efficient cooling. This product provides a long-lasting thermal solution, allowing for the safe cooling of a variety of components. The heat sink is low-cost, and its easy two-stage assembly makes installation a breeze. The high performance aluminum alloy construction and the special reflective surfaces ensure maximum air contact, resulting in efficient thermal management and superior cooling performance.
The specific data is subject to PDF, and the above content is for reference