| Allicdata Part #: | ATS-21B-131-C3-R0-ND |
| Manufacturer Part#: |
ATS-21B-131-C3-R0 |
| Price: | $ 5.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-131-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.55742 |
| 30 +: | $ 4.30416 |
| 50 +: | $ 4.05090 |
| 100 +: | $ 3.79777 |
| 250 +: | $ 3.54458 |
| 500 +: | $ 3.29140 |
| 1000 +: | $ 3.22810 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-21B-131-C3-R0 thermal-heat sink is a specialized product designed for applications that require thermal conductive cooling solutions. This device is made of high-grade aluminum with a thermal conductivity of up to 160W/m K, making it efficient and reliable. This device is commonly used in a variety of different electronic products, such as computers, telecom systems, and military applications.
The ATS-21B-131-C3-R0’s primary purpose is to effectively dissipate heat generated from electronic components, thereby protecting them from overheating and prolonging their life. This is accomplished via the heat sink\'s natural thermal insulation and through its fin design, which improves heat transfer from the base plate to its fins for optimal thermal dispersal. As the heat is dissipated, the air around the heat sink is cooled in the process, resulting in lower temperatures.
The ATS-21B-131-C3-R0 thermal-heat sink consists of an aluminum base plate, copper fins, and a top plate. The base plate is made of high-grade aluminum, offering excellent thermal conductivity. The copper fins are cross-shaped, and they distribute the heat across the surface of the base plate. The top plate is constructed using stainless steel, which provides additional strength and rigidity to the device. The fins are designed to draw in ambient air, which is then dissipated through the fin structure, allowing for cooling of the base plate, and ultimately, the electronic components.
The ATS-21B-131-C3-R0 thermal-heat sink is also designed to provide superior thermal protection. The design of the fins helps to keep the air circulating and supplies consistent, cool air to the components, even in conditions where air temperature may fluctuate. Additionally, the insulating properties of the base plate help to reduce the formation of hot spots on the electronics while improving its corrosion resistance.
In addition to dissipating heat, the ATS-21B-131-C3-R0 thermal-heat sink also offers the advantage of being highly customizable. It can be easily adapted to fit various applications, making it versatile for different types of electronics. This is due to its adaptable mounting mechanism and its ability to accommodate multiple attachment points. It is designed to meet the requirements of both commercial and military applications.
The ATS-21B-131-C3-R0 thermal-heat sink is a great option for applications that require high levels of thermal protection. Its advanced design offers superior heat dissipation, thermal protection, and the possibility of modification for specialized applications. This device is perfect for those who need reliable and efficient cooling solutions for their electronic components.
The specific data is subject to PDF, and the above content is for reference