| Allicdata Part #: | ATS-21B-14-C1-R0-ND |
| Manufacturer Part#: |
ATS-21B-14-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-14-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.96°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-21B-14-C1-R0 is a thermal heatsink designed for applications that require superior cooling performance. This heatsink is characterized by its low profile and efficient heat dissipation. The ATS-21B-14-C1-R0 is a single-piece heatsink designed with an aluminum base that extends into grooves and is designed to perfectly fit onto components such as transistors, MOSFETS, integrated circuits and many other electronic components. The ATS-21B-14-C1-R0 thermal heatsink is also designed to effectively dissipate heat away from the component, thus improving its efficiency and reducing its power consumption and operating temperature.
The ATS-21B-14-C1-R0 thermal heatsink is designed to maximize its heat dissipation capabilities by utilizing a combination of thermal radiating fins, multiple air-flow channels, and a highly efficient and cool running design. The thermal radiating fins are designed to maximize the air flow around the component and provide motion and ventilation, while the multiple air-flow channels are designed to carry the heat away from the component in a very efficient manner. Additionally, the highly efficient design also keeps components cool by dissipating the heat directly from the component to the fin array.
The ATS-21B-14-C1-R0 thermal heatsink has been designed to operate in extreme temperature and environmental conditions, making it suitable for a variety of applications. This heatsink can be used in applications that require extremely high powers and temperatures, such as embedded systems, consumer electronics, telecoms, aerospace, and automotive. Additionally, its low profile and efficient heat dissipation make it ideal for use in mobile or portable applications where size and thermal management are critical.
The efficiency of the ATS-21B-14-C1-R0 thermal heatsink is further enhanced by the use of silicone rubber gaskets which help to provide increased insulation and reduce the temperature rise of electronic components. Additionally, the ATS-21B-14-C1-R0 has been designed to ensure that it is compatible with industry standard mounting hardware, making it simple to install and maintain.
In conclusion, the ATS-21B-14-C1-R0 thermal heatsink is an efficient and effective cooling solution for a variety of applications. It features a low profile and is designed to dissipate heat away from the component in an efficient manner, while also offering excellent insulation. Additionally, its compatibility with industry standard mounting hardware makes it easy to install and maintain. The ATS-21B-14-C1-R0 thus provides a superior cooling performance for applications that require superior cooling performance.
The specific data is subject to PDF, and the above content is for reference