ATS-21B-14-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.97°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-21B-14-C2-R0 Application Field and Working Principle Thermal heat sinks play a vital role in the field of engineering, especially in the electronics world. They are used to help dissipate heat generated from electrical components, which in turn helps to keep components from overheating and potentially damaging not only themselves, but the equipment in which they are installed. A particular type of heat sink known as an ATS-21B-14-C2-R0 is designed to work in a variety of scenarios and in this article we will take a look at both its application field and the underlying working principle on which it operates.An ATS-21B-14-C2-R0 is an aluminum heat sink which is used to dissipate thermal energy from electronic components such as integrated circuits and power diode arrays. It is designed with an extruded aluminum fin section which helps to maximize the dissipation of heat and can effectively work in a temperatures up to 100 degrees Celsius. The aluminum fins are often arranged in a staggered pattern which helps to ensure an steady and efficient air flow. This type of heat sink can range in length depending on the desired application, but is typically between two and three inches in height. The ATS-21B-14-C2-R0 is designed to be easy to mount to a board or device and its installation only requires minimal modifications. This type of heat sink tends to sometimes require a mica or silicone pad to improve its thermal efficiency by providing additional insulation. The aluminum fins and base dimensions can be customized to fit a variety of different sizes and shape requirements, allowing for flexible product design and cost savings.The thermal working principle of the ATS-21B-14-C2-R0 is quite simple. The aluminum fins help to dissipate the generated thermal energy and subsequent heat away from the attached component or device. As heat is generated from the component, the aluminum acts as an efficient conductor, transferring the heat energy away from the component and allowing the component to remain at an optimal temperature. This termal energy is then dissipated out into the atmosphere, thus cooling both the heatsink and the attached device. The ATS-21B-14-C2-R0 is suitable for many different electronic devices and applications such as medical equipment, automotive electronics, LED lighting, and power supplies. The versatility of this type of heat sink lies in its ability to dissipate significant amounts of heat efficiently and its ability to be adjusted to fit almost any shape and size requirement. In summary, the ATS-21B-14-C2-R0 is a versatile thermal heat sink which offers multiple thermal solutions in various applications and scenarios. Its efficiency is due to its aluminum fin section which helps to dissipate heat away from attached electronic components. The thermal working principle is the result of heat energy being dissipated out into the atmosphere via the aluminum fins, thus helping to ensure that the heat produced does not impact the functioning of the device.

The specific data is subject to PDF, and the above content is for reference