ATS-21B-17-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	15.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-21B-17-C1-R0: Thermal Heat Sink Overview and Working Principle

The ATS-21B-17-C1-R0 is a type of thermal heat sink, designed to dissipate heat away from sensitive components and cool them down to an optimal temperature. This type of heat sink typically consists of one or more metal fins arranged in rows, which are connected to one or more metal heat plates. The metal fins act as a large surface area to spread the heat away from the components, while the metal heat plates act as a heat sink, absorbing and dissipating the heat away from the component. The working principle of the ATS-21B-17-C1-R0 is based on the thermodynamic principles of heat transfer. Heat is conducted from the component to the fins, which are then spread across their large surface areas. This spreads the heat across many small fins, allowing for a higher rate of heat loss due to the increased surface area. The heat is then further spread amongst the metal heat plates, resulting in a further decrease in temperature.The ATS-21B-17-C1-R0 is a highly efficient thermal heat sink, and is commonly used in a number of different applications, such as gaming consoles and computers, in order to maintain peak performance. It is also commonly used in industrial applications, where it is paramount to keep components cool under precise operational conditions. The ATS-21B-17-C1-R0 offers users a number of benefits. It is highly effective at dissipating heat, and can help maintain electronic devices, such as CPUs, at optimal temperatures. Additionally, heat sinks are often designed to include airflow to further increase cooling capabilities. Furthermore, due to their lightweight and compact design, they can be easily attached to any device, without taking up a lot of space. When opting for the ATS-21B-17-C1-R0, there are several factors to consider. For instance, the size of the component, the airflow of the device, and the total amount of heat being dissipated. Additionally, the customer should be aware of the manufacturing process of the thermal heat sink and ensure that it is of a high-quality standard. In conclusion, the ATS-21B-17-C1-R0 is a highly efficient thermal heat sink used in a variety of applications. It is designed to dissipate heat away from components by spreading the heat across its metal fins and heat plates. This helps maintain peak performance and is particularly useful in industrial and gaming applications. To ensure optimal cooling performance, customers should consider the size of the component, the airflow of the device, the total heat dissipated, and the quality of the manufacturing process.

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