| Allicdata Part #: | ATS-21B-179-C3-R0-ND |
| Manufacturer Part#: |
ATS-21B-179-C3-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-179-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are an important part of any system that uses electronics. ATS-21B-179-C3-R0, a thermal heat sink, is an example of a product designed to dissipate heat generated by electronic components. By dissipating this heat, equipment performance is maintained and life of the electronic component is extended.
The ATS-21B-179-C3-R0 thermal heat sink comprises a black anodized aluminum base and thermally conductive copper fins to maximize heat dissipation. The black anodized aluminum base acts as a heat spreader in combination with an adhesive base. This allows the heat sink to be attached to a variety of surfaces and to provide uniform heat dissipation across the area of the heat sink. The copper fins are designed to maximize heat transfer from the aluminum base. The fins will also increase the surface area of the heat sink to allow for greater heat dissipation.
The ATS-21B-179-C3-R0 thermal heat sink is designed for use in a variety of applications. The thermal heat sink is ideal for applications such as cooling processors, amplifiers, high-end workstations, server motherboards, and high frequency semiconductor devices. The heat sink can also be used in the automotive industry to cool radiators, alternators, and starters.
The working principle of the ATS-21B-179-C3-R0 thermal heat sink is based on the basic principle of conduction. Heat is transferred from the hot component to the heat sink via conduction. The heat is then dissipated through the copper fins of the heat sink. The increased surface area of the copper fins allows for increased heat dissipation. The aluminum base of the heat sink also helps to spread the heat more evenly across the heat sink. The adhesive base also allows for the heat sink to be easily attached to the desired surface.
In conclusion, the ATS-21B-179-C3-R0 thermal heat sink is an efficient way to dissipate heat generated by electronic components. The copper fins and black anodized aluminum base of the heat sink provide for improved heat conduction and increased heat dissipation. The adhesive base of the heat sink allows for easy attachment to a variety of surfaces. The ATS-21B-179-C3-R0 thermal heat sink is, therefore, an ideal choice for cooling processors, amplifiers, high-end workstations, server motherboards, radiators, alternators, and starters.
The specific data is subject to PDF, and the above content is for reference