ATS-21B-182-C3-R0

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Thermal management is a critical factor in maintaining effective operation with many types of electronic devices, ranging from computers and telecommunications equipment to home appliances and consumer electronics. Heat sinks are widely used in thermal management to provide an efficient method of dispersing and transferring heat generated by electronic components. The ATS-21B-182-C3-R0 is a thermal heat sink designed to provide a reliable and effective solution for heat dissipation in various electronic application fields. It is a high-performance device, featuring a thick aluminium base plate which allows excellent heat dissipation and high temperature control. Its fins are precision machined to ensure exact fitting, resulting in enhanced thermal transfer and significant contact pressure. The micro-fin construction ensures maximum heat dissipation while minimising total weight and footprint size. The ATS-21B-182-C3-R0 is compatible with a wide range of standard mounting systems, including but not limited to threaded screw-pins, press fit or plug-in installation, and comes with a compatible thermal paste for maximum heat transfer.The ATS-21B-182-C3-R0 heat sink is capable of dissipating up to 300 Watts of power in compact environments. Its advanced construction of multiple firings ensures high heat capacity and performance in highly compacted spaces. The design of the heatsink provides maximum efficiency at low flow resistance on all major components, including integrated circuits and powerful amplifiers. The thermal performance of the ATS-21B-182-C3-R0 is also good for its size.In terms of application fields, the ATS-21B-182-C3-R0 is perfectly suited for high powered applications, such as industrial equipment, telecommunications systems, automotive, medical and consumer electronics. The extreme reliability of the product makes it suitable for the aerospace and defense industries as well.The working principle of the ATS-21B-182-C3-R0 is based on a convective heat transfer process that uses a natural air flow between the heatsink and the components to which it is attached. When the air molecules move, they carry heat away from the components in the form of thermal energy. As the air flows over the surface of the heatsink, the fins are forced to vibrate, creating an increased surface area, which in turn, enables a higher dissipative capacity of the heatsink.The ATS-21B-182-C3-R0 thermal heat sink is an effective solution for heat dissipation in various electronics applications. Its advanced construction ensures maximum heat capacity and reliable performance in highly compacted spaces. The device is suitable for a wide range of applications, from industrial and automotive equipment to aerospace and defense systems. Furthermore, its convective thermal transfer principle provides a reliable and efficient solution for transferring the generated heat away from the surface of the components.

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