ATS-21B-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-21B-20-C1-R0-ND

Manufacturer Part#:

ATS-21B-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21B-20-C1-R0 datasheetATS-21B-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important component of any electronic system, so the selection of a properly sized heat sink is essential for efficient thermal performance. AAT-21B-20-C1-R0 is a heat sink designed to meet different thermal management needs. It comes in a variety of shapes and sizes, offering good thermal performance in a variety of applications.

The AATS-21B-20-C1-R0 heat sink is designed to be an effective solution for a variety of applications, such as consumer electronics, computer servers, medical equipment, and industrial environments. It can be used with a variety of power components, such as processors, power modules, FPGAs, and other components with high heat production. Additionally, it can be used in combination with other components for thermal management, such as fans and heatsinks.

The AATS-21B-20-C1-R0 heat sink is constructed with an aluminum alloy based on a patented design that provides efficient heat exchange between the heat sink and the component it is mounted on. The aluminum construction results in a lightweight yet robust heat sink that provides excellent heat dissipating properties. It also features a built-in fan, which increases the amount of heat it can dissipate. Additionally, the heat sink surface is designed with efficient cooling fins, which provide excellent air flow while dissipating heat effectively.

The AATS-21B-20-C1-R0 heat sink is designed to be used in a variety of conditions, including high temperatures, high vibration, and high air flow. It can also be used in extremely demanding environments, such as those found in automotive, aerospace, and military applications. Additionally, the AATS-21B-20-C1-R0 offers excellent corrosion and abrasion resistance, making it an ideal choice for any harsh environment.

The design of the AATS-21B-20-C1-R0 heat sink is based on the principles of thermodynamics. Specifically, the heat sink is designed to absorb heat from the components it is mounted on. As the heat is transferred from the component to the heat sink, it is then dissipated into the surrounding environment. The fan helps to facilitate this process by pushing air through the cooling fins, which helps to further dissipate the heat. As a result, the overall temperature of the components is kept at an optimal level.

The AATS-21B-20-C1-R0 heat sink is an ideal solution for those looking for a reliable and efficient thermal management solution. Its light weight yet robust design makes it suitable for a variety of applications. Additionally, its thermally efficient design and corrosion-resistant coating make it a great choice for demanding applications, such as those found in automotive, aerospace, and military applications. Lastly, the built-in fan helps to optimize the heat dissipation capabilities of this heat sink, making it an excellent choice for any thermal management solution.

The specific data is subject to PDF, and the above content is for reference

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