ATS-21B-20-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS34638-ND

Manufacturer Part#:

ATS-21B-20-C2-R0

Price: $ 4.98
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21B-20-C2-R0 datasheetATS-21B-20-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.52970
10 +: $ 4.40685
25 +: $ 4.16203
50 +: $ 3.91734
100 +: $ 3.67246
250 +: $ 3.42763
500 +: $ 3.18280
1000 +: $ 3.12159
Stock 1000Can Ship Immediately
$ 4.98
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.14°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Introduction

The ATS-21B-20-C2-R0 is a type of thermal device known as a heat sink. Heat sinks are designed to absorb and conduct heat away from a given source to keep that source from overheating. Heat sinks are most commonly used in electronics, but they are a crucial component in many other applications. The ATS-21B-20-C2-R0 heat sink is specifically designed for use in extreme environmental conditions, and is well suited to a wide variety of applications.

Application Field

The ATS-21B-20-C2-R0 heat sink is designed to provide thermal management for a variety of electronic components in extreme environmental conditions. This model is ideal for use in high-temperature, high-humidity, or high-altitude applications, and it is uniquely suited to handle temperatures up to an impressive 450°C. It is also well-suited for use in both indoor and outdoor environments due to its IP67 water-resistance rating.

The ATS-21B-20-C2-R0 is especially well-suited for use with medical and industrial equipment, as it is rated for use up to 145°C for up to 8 hours continuously. This makes it an ideal choice for applications such as protecting medical imaging systems or industrial machinery from overheating. Additional applications include use with home appliances, automotive electronics, telecom systems, and power conversion systems.

Working Principle

Heat sinks utilize conduction to transfer heat away from the source to the environment. As heat is generated by a given source, it begins to accumulate within the enclosure. Within a heat sink, heat travels through an aluminum or copper material, which is known as a fin. As heat accumulates in the fins, the ambient air or liquid coolant absorbs the heat, transferring it away from the source and back into the environment.

The ATS-21B-20-C2-R0 heat sink is built with an extruded aluminum base and a specially engineered cooling fin system. This mechanism allows the heat sink to quickly and efficiently dissipate heat from the source, while the waffle-patterned layer of fins increases the heat dissipation area, allowing it to operate at higher temperatures than other heat sinks.

The ATS-21B-20-C2-R0 also features a patented heat spreader that helps to evenly distribute heat away from the source, as well as an insulated back plate that helps to improve airflow and air-cooled heat dissipation. This combination of features ensures that the heat sink is able to provide cooling even in the most extreme conditions.

Conclusion

The ATS-21B-20-C2-R0 heat sink is a specialized device designed for efficient and reliable operation in extreme environmental conditions. It utilizes conduction, air cooling, and a specially designed fin structure to quickly and efficiently absorb and dissipate heat away from a given source, ensuring proper thermal management. This makes it an ideal choice for applications such as medical and industrial equipment, home appliances, automotive electronics, telecom systems, and power conversion systems.

The specific data is subject to PDF, and the above content is for reference

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