| Allicdata Part #: | ATS-21B-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-21B-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a component designed to provide a low-cost heat removal system for cooling electronic components. The ATS-21B-20-C3-R0 is a thermal heat sink designed specifically to meet the requirements of high-performance electronic components. It has a wide variety of applications, from low-power devices such as cell phones and portable media players to high-performance computers.
The thermal heat sink is composed of several primary elements. A base component, typically metal or aluminum, provides a solid foundation for the other components. Heat pipes are integrated into the base component to efficiently transfer heat from the component to the fins. Fins are attached to the heat pipes to create a larger surface area, allowing for a greater amount of heat to be dissipated. Fans are also attached to the heat sink to provide additional cooling and to reduce the noise generated by the thermal heat sink. Finally, a mounting system is attached to the bottom of the heat sink to attach it to the desired electronic device.
The thermal heat sink works by dissipating the heat generated by the electronic components. Heat is conducted from the electronic components by the base component and then is transferred by the heat pipes to the fins. The fins help to create a larger surface area to dissipate thermal energy, and the fans further increase the dissipation area. The mounting system secures the thermal heat sink to the electronic device, ensuring that the heat is dissipated efficiently and not lost due to vibration or movement.
The ATS-21B-20-C3-R0 thermal heat sink is designed to provide efficient cooling for electronic components without producing unwanted noise. It is constructed with a thin base component that makes it very lightweight and compact. The cooling capacity is increased by increasing the number of heat pipes and fins in the heat sink. The mounting system ensures a secure fit and the fans provide added cooling capacity and reduced noise. The heat sink is designed to comply with all safety and environmental regulations, making it safe and reliable.
The ATS-21B-20-C3-R0 thermal heat sink is designed for use in a variety of applications, from consumer devices to high-performance electronics. It is ideal for cooling small electronic components, such as CPUs, GPUs, and hard drives. The thin base and the efficient cooling capacity of the heat sink make it perfect for embedded applications, such as mobile phones and portable media players. The compact design and low noise production make it an ideal choice for use in home theaters and entertainment systems.
The ATS-21B-20-C3-R0 thermal heat sink is a reliable and efficient solution for cooling high-performance electronics. It is lightweight and compact, making it ideal for embedded applications. The heat pipes, fins, fans, and mounting system provide efficient cooling and increased surface area for dissipating thermal energy. The thermal heat sink is designed to meet all safety and environmental regulations, making it an ideal choice for cooling electronics.
The specific data is subject to PDF, and the above content is for reference