ATS-21B-33-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.50°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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IntroductionHeat sinks are widely used in many fields, from computers and communication devices to industrial equipment and medical instruments. Heat sinks are a form of thermal management, where heat is dissipated away from devices or components to keep them from overheating, or from operating at an excessive temperature. The ATS-21B-33-C3-R0 is a type of heat sink and its application fields and working principles will be discussed in this paper. ATS-21B-33-C3-R0 OverviewThe ATS-21B-33-C3-R0 is a type of three-dimensional aluminum heat sink which provides high-efficiency thermal solutions for high-power heating components, including LEDs and other electronic components. It is designed to dissipate heat away from the component using its aluminum fins which disperse the heat more effectively than other materials with greater surface area. The ATS-21B-33-C3-R0 also features a built-in fan which helps draw away heated air from the component and into the aluminum fins, further improving its cooling capabilities.Application Fields and Working PrincipleThe ATS-21B-33-C3-R0 heat sink is suitable for use in a variety of different application fields, including computers, medical instruments, communication devices, and a wide range of industrial equipment. It can be used for tasks such as dissipating heat away from powerful processors, as well as controlling temperatures in cabinets or storage units. Furthermore, it can be used to cool electronic components, including LEDs, transistors, diodes, and more.The working principle of the ATS-21B-33-C3-R0 heat sink is fairly simple. It utilizes a combination of its aluminum fins and the built-in fan to dissipate heat away from the component. The aluminum fins absorb the heat from the component and the fan draws away the heated air and directs it into the fins, where it is dissipated away.ConclusionThe ATS-21B-33-C3-R0 heat sink is an effective and efficient way of dissipating heat away from components and devices. It can be used in a variety of different application fields, including computers, communications devices, and a wide range of industrial and medical instruments. The design of the ATS-21B-33-C3-R0 incorporates aluminum fins which absorb the heat from the component, as well as a built-in fan which further increases cooling capabilities. The combination of these two components makes the ATS-21B-33-C3-R0 an ideal choice for those looking for effective thermal management solutions.

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