ATS-21B-36-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-21B-36-C1-R0-ND

Manufacturer Part#:

ATS-21B-36-C1-R0

Price: $ 5.26
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X11.43MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21B-36-C1-R0 datasheetATS-21B-36-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.73067
30 +: $ 4.46796
50 +: $ 4.20512
100 +: $ 3.94235
250 +: $ 3.67953
500 +: $ 3.41671
1000 +: $ 3.35100
Stock 1000Can Ship Immediately
$ 5.26
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.81°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

The ATS-21B-36-C1-R0 is designed to thermal manage heat-generating components. This type of device is commonly referred to as a heat sink. A heat sink is an essential element included in every electronic circuit design, and can be used in a variety of applications. Heat sinks are used to passively remove thermal energy from components and other sources and transport the heat away from the component to dissipate the thermal energy via convection, radiation or other thermal management methods.

ATS-21B-36-C1-R0 Application Field

The ATS-21B-36-C1-R0 has applications for a variety of electronic devices and components. The device is capable of efficiently removing thermal energy from the following components: CPU and GPU heat sinks, switch boxes, power supplies, and other components operating in relatively high temperature environments. The ATS-21B-36-C1-R0 is well-suited for uses in computing, communications, and industrial systems.

ATS-21B-36-C1-R0 Working Principle

The ATS-21B-36-C1-R0 is constructed with a heatsink baseplate and a series of aluminum fins. These fins are designed to dissipate heat away from the component, while the baseplate provides a thermally conductive pathway to transfer the heat away from the source. By dissipating the thermal energy away from the source component, the device keeps the temperature of the component within its acceptable operating range and significantly prolongs its lifespan.

The ATS-21B-36-C1-R0 also features other advanced thermal management features. For example, the device includes a high-flow air blower to ensure adequate cooling air to the component, as well as grooved channels on the baseplate to direct air flow to specific areas of the component. Additionally, the device is designed for easy installation on a variety of surfaces, making it an ideal choice for many applications.

Conclusion

The ATS-21B-36-C1-R0 thermal heat sink is an ideal solution for managing high-temperature components in a variety of different applications. The device is designed to be highly efficient at dissipating thermal energy, helping to ensure the component remains within its acceptable temperature range and prolongs its lifespan. Additionally, the ATS-21B-36-C1-R0 features features for optimizing its cooling performance and is relatively easy to install on a variety of surfaces.

The specific data is subject to PDF, and the above content is for reference

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