| Allicdata Part #: | ATS34670-ND |
| Manufacturer Part#: |
ATS-21B-53-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-53-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal or heat sink is a device designed to keep objects or components cool by dissipating large amounts of heat generated by those objects or components. Such devices have become increasingly popular in many consumer electronics applications, such as laptop coolers, night vision systems, and computer processors that rely on their thermal management to work properly. The ATS-21B-53-C2-R0 is a new and innovative thermal heat sink that has revolutionize the industry.
The ATS-21B-53-C2-R0 consists of a series of highly efficient aluminum fins that serve to absorb and dissipate the heat build up from electronic components. The fins are formed into a compact and curved shape which allows for a larger surface area for heat dissipation. In addition, the fins are stacked vertically in order to increase air flow and increase the heat exchange rate. This allows the ATS-21B-53-C2-R0 to be up to twice as effective as other conventional heat sinks.
In addition to its superior thermal performance, the ATS-21B-53-C2-R0 also offers superior reliability. It is manufactured using an advanced die-cast aluminum construction process that ensures that the heat sink is structurally sound and has minimal risk of breakage, corrosion, or other damage. This also enables the ATS-21B-53-C2-R0 to be more effective even in extreme climates and temperatures, where other models may fail.
The ATS-21B-53-C2-R0 can be mounted to any electronic component or device with ease. It can also be easily unmounted for maintenance or other purposes. The ATS-21B-53-C2-R0 also comes with a variety of mounting accessories that can be used to fit the heat sink in a variety of locations.
The working principle of the ATS-21B-53-C2-R0 is based on convection and conduction. The aluminum fins act as a medium in which heat can be efficiently absorbed and dissipated. The fins are stacked in such a way as to allow air to circulate around them, which facilitates the heat transferring from the electronic components to the air and eventually away from the device.
The ATS-21B-53-C2-R0 is an ideal solution for electronics applications that require reliable thermal management. The heat sink\'s superior construction and design ensure that it can effectively dissipate large amounts of heat generated from electronic components. In addition, the ATS-21B-53-C2-R0\'s ease of mounting and maintenance make it a great choice for maximum convenience and reliability.
The specific data is subject to PDF, and the above content is for reference