| Allicdata Part #: | ATS-21B-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-21B-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions using heat sinks are becoming increasingly important for optimizing the performance of many different applications. The ATS-21B-60-C1-R0 is an example of such a heat sink solution. It’s a two-stage heat sink with a fin-to-fin spacing of 0.025 inches. The ATS-21B-60-C1-R0 is designed to provide improved performance in a number of applications, such as high power RF amplifiers, power supplies, processors, and other power components.
The ATS-21B-60-C1-R0 uses a simple yet effective two-stage design featuring dual aluminum fins that conduct heat away from sensitive components quickly and efficiently. The fins are bonded in place with an integrated thermal headset material to ensure maximum heat transfer. The fins are spaced just 0.025 inches apart, which allows for more surface area to dissipate heat, and further helps to reduce the temperature of the components.
The ATS-21B-60-C1-R0 is designed to improve the performance of high power RF amplifiers and other components. The two-stage design allows it to draw heat away from sensitive components quickly and efficiently. The integrated thermal headset material improves the heat transfer rate, while the 0.025 inch fin-to-fin spacing increases the surface area and further reduces the temperature of the component. The increased surface area also helps to reduce the thermal resistance and provides greater thermal stability.
The ATS-21B-60-C1-R0 is an excellent choice for any application requiring improved thermal management. It provides an efficient, low-cost solution for heat dissipation that can greatly improve the performance of any application. The two-stage design and integrated thermal headset material provide excellent heat transfer rates, while the 0.025 inch fin-to-fin spacing increases the surface area and allows for greater thermal stability. With its improved performance, the ATS-21B-60-C1-R0 is an ideal solution for thermal management.
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