| Allicdata Part #: | ATS-21B-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-21B-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21B-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are perhaps the single most important component when discussing electronics of any kind. This is because they absorb the heat generated from the operating electronic components and dissipate it away, keeping electronics operating within their rated temperature limits and preventing premature failure due to overheating. The ATS-21B-70-C1-R0 heat sink is an ideal candidate when it comes to thermal management requirements. It is a one-piece, high-efficiency heat sink that offers both high levels of cooling and easy installation.
Application Field
The ATS-21B-70-C1-R0 heat sink can be installed on a wide range of electronic devices, from small devices like computers and consumer electronics to larger industrial applications. Due to its high thermal performance levels, it is also suitable for applications that require high levels of thermal management performance, such as with high-end gaming systems, enterprise-level servers, and other applications that require consistency and reliability.
The ATS-21B-70-C1-R0 is specifically designed for high thermal management performance and therefore is ideal for applications that require high levels of cooling. The product dimensions are optimized for maximum efficiency and improved thermal performance. Its flexible design allows for easy installation and it can be used in many different shapes and sizes.
Working Principle
Heat sinks are designed to absorb and dissipate heat from the operating components of an electronic device. ATS-21B-70-C1-R0 works on the principle of thermodynamics, which states that heat always goes from a hotter area to a cooler area. The heat sink is designed in a way that it contains many small fins that allow for air to pass through, cooling the fins in the process. As the air passes through the fins, it takes away the heat and thus absorbs the heat from the operating components of the device. This process of air passing through the fins helps to keep the temperature of the device within its rated limits.
The ATS-21B-70-C1-R0 heat sink is also designed to have a high thermal capacity or “heat sink” coefficient which means that they can absorb more heat than other standard heat sinks. This makes them ideal for applications that require thermal management, and for those applications that may require high levels of cooling. Additionally, the ATS-21B-70-C1-R0 has proven to be much more effective in dissipating more heat than other standard heat sinks, furthering its value in thermal management.
Benefits of ATS-21B-70-C1-R0 Heat Sinks
The ATS-21B-70-C1-R0 heat sink is a reliable, high performance, and cost effective solution for cooling electronic devices. Its flexible design allows for easy installation and because of its unique shape, it can be used in many different sizes and shapes. The fins are also designed in a soft material to provide maximum surface area contact, allowing for maximum thermal absorption capacity. Thanks to its large thermal capacity, the ATS-21B-70-C1-R0 heat sink can effectively dissipate heat away from sensitive electronics quickly and reliably.
The ATS-21B-70-C1-R0 heat sink has also proven to be long lasting, with minimum maintenance requirements, making it suitable for applications that require long-term reliability. Additionally, they are highly efficient and cost effective, making them an ideal solution for high-performance applications that require consistent and reliable thermal management. Finally, due to its multiple designs, the ATS-21B-70-C1-R0 can easily be integrated into existing cooling systems, making it a great choice for applications that require thermal management solutions.
Conclusion
The ATS-21B-70-C1-R0 heat sink is an excellent choice when it comes to thermal management requirements. It offers a high level of cooling performance in addition to offering easy installation thanks to its flexible design. Additionally, its larger thermal capacity and cost effectiveness make it an ideal choice for those applications that may require high levels of cooling. Finally, this heat sink is also long lasting and requires minimum maintenance, making it suitable for applications that require long-term reliability.
The specific data is subject to PDF, and the above content is for reference