ATS-21B-72-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.19°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-21B-72-C3-R0 Thermal - Heat Sinks

The ATS-21B-72-C3-R0 is a thermal - heat sink designed to be used in electronic components that require a steady state of cooling. It is an efficient cooling system that is able to effectively dissipate heat away from the electronics. This heat sink has a unique design, as it is constructed from aluminum and features an oxide coated interface for enhanced performance.

Application Field & Working Principle

The ATS-21B-72-C3-R0 is primarily used in applications where heat must be handled quickly and efficiently. Most common uses include motherboard cooling for gaming systems, air cooled graphic cards, and cooling of integrated circuits. It is also used in CPU cooling for server and workstation computing.The working principle of the ATS-21B-72-C3-R0 is to draw heat away from the electronic components, as metal is an efficient conductor of heat. The thermal - heat sink is designed to absorb the heat, which is conducted through its base and fins. The heat is then dispersed throughout the fins where it can dissipate quickly due to the built-in ventilation flutes. This efficient radiator can quickly remove the heat and keep the electronic device cooled.

Design and Features of ATS-21B-72-C3-R0 Thermal - Heat Sinks

The design of the ATS-21B-72-C3-R0 is based on the concept of efficient heat dissipation. It is designed with a high-standard of efficiency in mind, since it is made of aluminum and its interface is specially coated with an oxide material to provide superior heat dissipation.The ATS-21B-72-C3-R0 comes with two types of fins, namely, flat fins and angular fin profiles. The flat fins offer low resistance to airflow, while the angular fin profiles provide increased surface area for improved cooling performance. The thermal - heat sink also has four mounting supports with double-ended hole patterns.

Performance & Advantages of ATS-21B-72-C3-R0 Thermal - Heat Sinks

The performance of the ATS-21B-72-C3-R0 thermal - heat sink is excellent. It is able to dissipate heat quickly and efficiently without becoming too hot. This is ensured by its oxide coated interface, which helps to transfer heat away from the electronic components quickly. Additionally, the flat and angled fin profiles provide increased surface area, which enables the heat sink to cool quickly.One of the biggest advantages of the ATS-21B-72-C3-R0 thermal - heat sink is that it is designed for maximum efficiency. As a result, it is able to dissipate the heat away from the electronic components quickly and keep them cool. Furthermore, the design of the thermal – heat sink ensures that it is able to fit most applications, and it is also easy to install.

Conclusion

The ATS-21B-72-C3-R0 thermal - heat sink is a highly efficient cooling device that is designed to quickly cool electronic components. Its oxide coated interface ensures that it can quickly transfer the heat away from the electronic devices that are using it. Additionally, its flat and angled fin profiles provide maximum cooling efficiency. As a result, this thermal - heat sink is able to effectively cool components such as motherboards, CPUs, and graphics cards, providing stability and reliability while working.

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