ATS-21B-95-C2-R0

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The ATS-21B-95-C2-R0 is a thermal – heat sink product designed to provide a reliable, efficient means of heat dissipation from heat sources in electronic components. Typically, heat sinks absorb heat generated through the breakdown of components or the operation of other electronic components in the system and disperse it into the surrounding air or the environment. In some applications, this heat can cause malfunction and component failure, making proper heat sink design and selection critical.

ATS-21B-95-C2-R0 is designed for use in applications where high levels of heat dissipation are required. Applications include those where highly customized cooling solutions are needed, such as in the aerospace, medical, consumer electronics, and robotics industries. It is also used for heavy-duty applications such as power converters, servomotors, and DC fans.

The working principle of ATS-21B-95-C2-R0 is based on the principle of effective thermal conductivity. In simple terms, it works by increasing the surface area of the heat sink, which allows the heat to travel quickly away from the heat source. This effectively minimizes the amount of time heat spends within the unit, thereby reducing the risk of component failure. The design of the fins on the sink also plays a role in maximizing the effect of the heat transfer. The fins are designed to take advantage of convective currents in the air, and have proven to be highly effective in heat dissipation.

In addition to its primary functions for heat dissipation, ATS-21B-95-C2-R0 provides protection to electronic components, such as those in the aerospace industry, where dust and other debris can accumulate and cause damage. The dustproof and waterproof design of this heat sink guard against water, dust, and other contaminants, ensuring the components are operating safely and efficiently.

ATS-21B-95-C2-R0 also features a variety of customization options. These include copper, aluminum, and plastic options for the heat sink itself, along with various finish options. The fins can be designed for specific airflow requirements, air pressure, and desired temperature drop for maximum performance. Additionally, the heat sink can be sized according to the customer’s demands, and the dielectric constant as well as the thermal conductivity can be modified to provide superior results.

In conclusion, ATS-21B-95-C2-R0 is a heat sink product designed to efficiently dissipate heat from components in a variety of industries. The device is based on the principle of effective thermal conductivity, and features dustproof and waterproof design as well as a variety of customization options to meet the individual needs of a wide variety of applications. It is an ideal choice for efficient and reliable heat dissipation from a variety of heat sources in electronic components.

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