ATS-21C-02-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-21C-02-C3-R0, commonly referred to as a heat sink, is a commonly used type of thermally-induced passive component used in a wide range of electronics and electrical engineering applications. The device serves the purpose of dissipating heat generated from electronic elements, and is typically installed or positioned on the element in question\'s surface.The ATS-21C-02-C3-R0, due to its thermal characteristics, is located in a specific class of heat sinks, namely that of extruded aluminum heat sinks, rather than those that are bonded and machined from copper or other material. As such, the ATS-21C-02-C3-R0 is composed of an aluminum extrusion die-cast in its housing, as well as a metalized aluminum laminate, or mating, surface on its top, giving the device its distinctive look.The ATS-21C-02-C3-R0 possesses a number of properties that makes it highly effective in some specific applications. Firstly, its aluminum die-cast housing aids in minimizing thermal resistance to the enclosed air, shielding the underside of the device from any potential heat build-up. Moreover, the laminate, metalized top surface of the device is a highly efficient thermal conductor, allowing for smoother heat dissipation and equalizer when mounted on the source component.In accordance to its name, the ATS-21C-02-C3-R0 defines its electronic industry application field as being applicable to thermal applications. These applications are similar to those of industrial and automotive applications, such as thermal management and cooling of specific components, including ICs (Integrated Circuits), controllers and microprocessors. It is also used to dissipate heat generated by photo optical systems, telecommunications components and many other electronic elements.Regarding the operating principle of the ATS-21C-02-C3-R0, the device can be said to possess an inherent natural cooling skill based on convection and radiation; In other words, it operates by bringing the heat out of the associated electronic element by means of creating a continuous air flow, most notably at the top of the device, and then by allowing the confined air to effectively dissipate the heat out of the area for more efficient cooling.Furthermore, the heat sink can also be used in tandem with other electronic elements, such as fans, coolers and ventilators, that require additional cooling functions in order to cope with very high temperatures, such as those that may be generated in a mobile network application environment. In this case, the ATS-21C-02-C3-R0 and the other elements act in conjunction with each other, with the heat sink receiving the majority of the heat transfer in order to cool and disperse the produced heat from the high temperature element.The ATS-21C-02-C3-R0 is a versatile component, offering superior temperature control in a variety of settings. From its wide range of thermal management and cooling functions to its compatibility with the various other electronic elements, the device is highly effective in cooling and dissipating heat to maintain optimum temperature standards. It is for these reasons that the ATS-21C-02-C3-R0 is seen as one of the most reliable and efficient passive thermal components currently in use in the electronic industry.

The specific data is subject to PDF, and the above content is for reference