Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks, also known as heat spreaders, are devices that help dissipate heat from electronic components into the atmosphere by providing a greater surface area than directly contacting the component. Thermal management is often required for high-power circuitry, so that the temperature of the component does not rise to a level where it could cause damage or cause the system to perform poorly. One of the most popular applications of heat sinks is the ATS-21C-10-C1-R0.

The ATS-21C-10-C1-R0 is a type of heat spreader that is made of thermally-conductive composite material. It has a copper core and a highly-conductive surface that helps disperse the heat from the electronic components. The construction of the spreader also allows it to handle a wide range of temperatures, from -65°C to +135°C, as well as higher power densities. This allows the spreader to be used in an environment with high thermal loads.

In its most basic form, the ATS-21C-10-C1-R0 works by dissipating the heat from the component and transferring it away using the thermal conductivity. This helps to keep the component at a lower temperature, allowing it to work more efficiently and for longer periods of time. Additionally, due to the large surface area of the spreader, a large amount of heat can be dissipated in a short period of time. This makes the spreader ideal for applications involving high power and large loads.

The ATS-21C-10-C1-R0 can be used in a variety of applications such as computer processors, video cards, cell phones, servers, power supplies, and any other application where thermal management is important. In addition, it can be used to improve the heat dissipation in LED lighting, as well as solar panels and other applications.

The ATS-21C-10-C1-R0 is an ideal choice for thermally-sensitive applications due to its large surface area and high-performance characteristics. Its design ensures maximum heat transfer with minimal resistance. Additionally, its low-profile design makes it a great choice for applications with tight spaces.

The ATS-21C-10-C1-R0 heat spreader can provide exceptional thermal management capabilities, making it an ideal option for applications that put pressure on their components. It is easy to install and provides reliable, long-lasting performance. In addition, it is relatively lightweight, making it ideal for a variety of applications.

The specific data is subject to PDF, and the above content is for reference