| Allicdata Part #: | ATS-21C-136-C1-R0-ND |
| Manufacturer Part#: |
ATS-21C-136-C1-R0 |
| Price: | $ 6.36 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21C-136-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.72544 |
| 30 +: | $ 5.40750 |
| 50 +: | $ 5.08939 |
| 100 +: | $ 4.77131 |
| 250 +: | $ 4.45322 |
| 500 +: | $ 4.13513 |
| 1000 +: | $ 4.05561 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks are an important component of any electronic device. The ability to effectively dissipate heat generated by components is essential to their successful operation. The ATS-21C-136-C1-R0 is a high quality, standard force-convection heat sink product specifically designed for cooling sensitive electronic components.
Application Field
The ATS-21C-136-C1-R0 heat sink has been developed for cooling various electronic components in high temperature, low importance applications. It is suitable for cooling components such as voltage regulators, power transistors and other high power components.
The design of the ATS-21C-136-C1-R0 heat sink is specifically suited for component cooling applications in the communication and aviation industries. It is suitable for cooling components that are used in signal processing and power supply systems.
The use of the ATS-21C-136-C1-R0 heat sink can also provide advantages in the consumer electronics market. Its superior heat dissipation capabilities, small size and weight, and low cost make it an ideal choice for cooling components in devices such as mobile phones, tablets, laptops and other consumer electronics.
Working Principle
The ATS-21C-136-C1-R0 heat sink is a standard, force-convection type heat sink that operates on the principle of thermodynamics. This principle states that hot air rises and cold air sinks. In this case, the heat sink is designed to provide the necessary air flow to transfer the heat from the hot component to the cold air.
The ATS-21C-136-C1-R0 uses two main pieces: a large base that attaches to the component and a smaller top plate that sits on top of the base. The base and top plate of the heat sink are separated by a thermal gap to allow air to flow freely between the two plates. The top plate is designed to increase turbulence inside the two plates, allowing more air to be drawn in and more effective heat dissipation.
The ATS-21C-136-C1-R0 heat sink is constructed from high quality aluminum alloy that is designed to withstand high temperatures and long-term usage. The heat sink also features a black anodized finish that is designed to reduce corrosion and help keep the heat sink looking attractive.
The ATS-21C-136-C1-R0 heat sink is the ideal choice for cooling sensitive electronic components and providing efficient heat dissipation. It is highly recommended for applications in the communication and aviation industries as well as the consumer electronics market. With its reliable performance, high-quality construction, and attractive appearance the ATS-21C-136-C1-R0 is the perfect choice for protecting sensitive components from heat damage.
The specific data is subject to PDF, and the above content is for reference