| Allicdata Part #: | ATS-21C-14-C3-R0-ND |
| Manufacturer Part#: |
ATS-21C-14-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-21C-14-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
Specifications
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Description
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Introduction
Heat sinks are becoming increasingly popular in a variety of applications. With their ability to dissipate heat generated by electronic components, including CPUs, graphics cards and power amplifiers, they have the potential to significantly improve the performance, cost and efficiency of these components. One particular type of heat sink that stands out among the rest is the ATS-21C-14-C3-R0. This heat sink has specific benefits that make it well suited for a variety of applications and installations.ATS-21C-14-C3-R0 Configuration
The ATS-21C-14-C3-R0 is a skived fin heat sink which is composed of many individual aluminum fins that have been cut precisely from a solid aluminum block using specialized CNC machinery. This ensures a high degree of precision and accuracy in both the size and spacing of the fins. The ATS-21C-14-C3-R0 features a tightly packed fin array with a low profile design which allows for maximum heat transfer with minimal space requirements. The heat sink also features a fin moisture-resistant coating which helps protect the fins from corrosion and other environmental factors.ATS-21C-14-C3-R0 Application Field
The ATS-21C-14-C3-R0 is designed for use in a variety of applications, including but not limited to servers, CPUs, GPUs, memory modules, and power supplies. It is particularly well suited for use in high-performance electronic systems that need to be able to dissipate relatively large amounts of heat in a limited amount of space. For example, the ATS-21C-14-C3-R0 can be used in high-end military or aerospace systems that must be able to operate in extreme conditions such as high pressure, low temperatures, and high-intensity vibrations.ATS-21C-14-C3-R0 Working Principle
The ATS-21C-14-C3-R0\'s working principle is based on the convection process. The heat from the electronic components is transferred to the aluminum fins via thermal conduction. As the fins heat up, air is drawn in through the fin array and heated further by the fins. The heated air rises and mixes with cooler, ambient air, transferring more heat from the aluminum fins in the process. This convection process results in a steady stream of heated air being drawn away from the electronic components, helping to keep them within the specified temperature range.Conclusion
The ATS-21C-14-C3-R0 is a high-performance heat sink that is well suited for a variety of applications, including those involving high-performance systems that need to operate in extreme conditions. Its efficient fin array and low profile design allow it to effectively dissipate heat generated by electronic components in a relatively small amount of space. The ATS-21C-14-C3-R0\'s working principle is based on convection, allowing it to remove heat from the electronic components while ensuring they are kept within the specified temperature range.The specific data is subject to PDF, and the above content is for reference
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ATS-21C-14-C3-R0 Datasheet/PDF