ATS-21C-154-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS34786-ND

Manufacturer Part#:

ATS-21C-154-C2-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-21C-154-C2-R0 datasheetATS-21C-154-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.84930
10 +: $ 3.74787
25 +: $ 3.53934
50 +: $ 3.33119
100 +: $ 3.12304
250 +: $ 2.91483
500 +: $ 2.70663
1000 +: $ 2.65458
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.51°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-21C-154-C2-R0 Application Field and Working Principle

Thermal and heat sinks are a type of component used to dissipate heat generated by other components in an electronic system. Heat sinks are typically used in conjunction with cooling fans and other cooling mechanisms to increase efficiency and performance. The ATS-21C 154-C2-R0 heat sink is an example of a high quality, reliable and efficient heat sink. It is widely used in the telecommunications, computing and industrial automation sectors.The ATS-21C 154-C2-R0 is designed to be compatible with many different types of modules, including Intel Core and AMD Processors. It is a highly efficient heat sink that is capable of dissipating hot air away from the CPU core quickly and efficiently. This heat sink features a high-temperature resistance profile, allowing it to dissipate large amounts of heat without sacrificing the integrity of the CPU or other components. It also offers an array of mounting options, making it suitable for a wide variety of applications.The ATS-21C 154-C2-R0 operates on the principle of thermal conduction. Thermal conduction is the transfer of heat energy from one material to another through direct contact. In this case, thermal energy is transferred from the dissipating module, such as the CPU, to the heatsink. The heatsink then dissipates the heat away from the CPU by using a combination of conduction and convection. The base of the heatsink is in direct contact with the CPU and transfers the heat energy to the heatsink body.The ATS-21C 154-C2-R0 is built using an aluminum alloy that has an excellent thermal conductivity rating. The fins of the heatsink are designed in a way to provide maximum surface area for heat dissipation. Additionally, the heatsink also features a series of heat pipes that are designed to further enhance the heat dissipation capabilities of the heatsink. Heat pipes are hollow tubes filled with a liquid, usually a copper or aluminum-based alloy, that is able to quickly transfer thermal energy from one area to another.The ATS-21C 154-C2-R0 is also equipped with a thermistor. The thermistor is a device that is capable of accurately measuring the temperature of the component or system being cooled. This thermistor works in conjunction with the heatsink’s cooling system, providing a feedback loop that ensures proper heat dissipation from the component or system.In addition to providing excellent cooling capabilities, the ATS-21C 154-C2-R0 also offers excellent acoustic performance. This is because the heatsink is designed with a low acoustic profile. This helps to reduce the noise generated by the cooling system, especially when compared to other heatsink designs. This acoustic dampening effect helps to ensure that users are not disturbed by excessive noise.The ATS-21C 154-C2-R0 is an incredibly efficient and reliable heat sink that is suitable for a variety of applications and can be used in both consumer and professional environments. It is a reliable and efficient choice for anyone looking for an efficient and reliable heatsink that is capable of dissipating hot air away from the CPU core quickly and efficiently. It also offers an array of mounting options, making it suitable for a wide variety of applications.

The specific data is subject to PDF, and the above content is for reference

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