| Allicdata Part #: | ATS-21C-32-C1-R0-ND |
| Manufacturer Part#: |
ATS-21C-32-C1-R0 |
| Price: | $ 5.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21C-32-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.71933 |
| 30 +: | $ 4.45704 |
| 50 +: | $ 4.19492 |
| 100 +: | $ 3.93271 |
| 250 +: | $ 3.67053 |
| 500 +: | $ 3.40835 |
| 1000 +: | $ 3.34281 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a critical component in the component in the engineering industry. They provide the necessary cooling mechanism for a wide variety of electronic devices. The ATS-21C-32-C1-R0 is one such Heat Sink that is commonly used in the engineering industry.
The ATS-21C-32-C1-R0 heat sink is a low-profile, high-performance heat sink designed to handle thermal loads of up to 16W. It has a dimension of 72mm x 38mm and is constructed of a non-conductive aluminum alloy with a black anodized finish.
The application field for the ATS-21C-32-C1-R0 is wide ranging. It is commonly used in electronic devices such as computers, phones, tablets, home entertainment systems, power supplies, medical equipment, automotive systems, and many other areas where thermal management solutions are needed.
The working principle of the ATS-21C-32-C1-R0 is based on the principles of heat transfer. Heat is released from the device into the surrounding environment and the heat sink absorbs this heat energy. This absorbed energy is then dissipated into the air with the help of a cooling mechanism, like a fan or an airflow. The fins of the heat sink also provide a greater surface area to dissipate heat evenly.
The ATS-21C-32-C1-R0 is designed with a special pin-and-socket-shaped base that allows it to be mounted directly on the CPU. This ensures that the heat is concentrated in one area and then dissipated quickly and evenly over the entire area. Additionally, it has a specially designed thermal gap pad to provide better thermal contact with the CPU and reduce the thermal resistance.
The ATS-21C-32-C1-R0 is constructed from a high-quality aluminum alloy and has an anodized finish that is highly resistant to corrosion. It is also designed for low-noise operation and features an ultra-low profile design to reduce the height of the components. Additionally, it is UL and CE certified for safety and quality assurance.
The ATS-21C-32-C1-R0 is an ideal choice for a wide range of applications and it has been proven to provide reliable thermal management solutions for both professional and consumer electronics.
The specific data is subject to PDF, and the above content is for reference