| Allicdata Part #: | ATS34881-ND |
| Manufacturer Part#: |
ATS-21C-66-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21C-66-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to radiate and dissipate heat from the electronic components of a system. Thermal management is especially essential for thermal sensitive electronic components like microprocessors, video cards, memory and other high-efficiency electronics. Heat sinks are the most efficient solutions for eliminating heat and increasing the overall performance of a system.
The ATS-21C-66-C2-R0 heat sink is a reliable thermal solution, specifically designed to cool and protect high-density computers and other high-wattage electronics. This device is a 2-piece bonded fin heat sink, constructed from high grade aluminum and featuring a round shape. Its efficient design opens up more possibilities for system cooling and can take temperatures up to 125°C.
The ATS-21C-66-C2-R0 is designed with staggered fin configuration, increasing the heat sink’s overall surface area for better thermal contact with the component. This helps maximize heat dissipation and minimize the risk of overheating or component damage. The heat sink also features a high-quality extruded aluminum base to optimize airflow and ensure fast effective cooling. The bottom of the heat sink has thermally enhanced B-stage silicone thermal compounds, which helps to ensure the most efficient heat transfer to maximize the cooling capabilities of the ATS-21C-66-C2-R0.
The working principle of the ATS-21C-66-C2-R0 is relatively simple and effective. The heat sink\'s highly efficient design rapidly draws heat away from the components, which then radiates and dissipates the heat throughout the surrounding environment. Heat sinks are mainly designed to draw heat away by conduction – sinking the heat away from the system\'s components and dissipating it into the atmosphere. This increases the overall lifespan of the system\'s components.
The ATS-21C-66-C2-R0 is typically used in applications such as industrial automation, energy management systems, power supplies, and other high-wattage computer-related applications. It can also be used in medium to large-sized systems that require cooling for high wattage components. The heat sink\'s design makes it ideal for applications that require a lot of heat dissipation in a relatively small area. With its efficient and reliable design, the ATS-21C-66-C2-R0 is a great choice for keeping your electronic components operating at their peak performance.
The specific data is subject to PDF, and the above content is for reference