| Allicdata Part #: | ATS34885-ND |
| Manufacturer Part#: |
ATS-21C-70-C2-R0 |
| Price: | $ 4.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-21C-70-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.51710 |
| 10 +: | $ 4.39551 |
| 25 +: | $ 4.15120 |
| 50 +: | $ 3.90701 |
| 100 +: | $ 3.66282 |
| 250 +: | $ 3.41863 |
| 500 +: | $ 3.17444 |
| 1000 +: | $ 3.11340 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.70°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks have been used for many years to help regulate heat transfer from a device or component. The ATS-21C-70-C2-R0 is one of the leading thermal-heat sinks on the market. This device is designed for applications where heat must be quickly dispersed in order to prevent heat buildup that could result in device malfunction. What makes the ATS-21C-70-C2-R0 unique is its ability to effectively dissipate thermal energy from a wide range of devices.
The ATS-21C-70-C2-R0 is a finned-tube heat sink which can be used in applications where air cooling is preferred. It features a tube-shaped thermal fin structure which maximizes the amount of air flow through the device. This helps to reduce the temperature of the device while also decreasing overall device power consumption. The finned-tube structure also helps to reduce vibration, making the device quieter and more efficient.
The primary application field of the ATS-21C-70-C2-R0 is in electronics and telecommunications. This device can be used to cool down circuits, chips, sensors, transistors, and other electronic components. It is also well suited for use in telecommunications systems where heat build-up can interfere with the performance of the system. The ATS-21C-70-C2-R0 is also ideal for cooling CPUs, memory modules, and storage devices due to its high efficiency.
The working principle of the ATS-21C-70-C2-R0 can be broken down into two parts; thermal dissipation and air convection. The thermal dissipation occurs when heat is transferred from the device or component to the fins of the heat sink. The heat is then transferred to the air as a result of the air convection. The air flow created by the fins helps to quickly disperse any heat away from the component or device. This in turn helps to prevent any thermal overload that could potentially damage the device.
The ATS-21C-70-C2-R0 is a reliable and efficient thermal-heat sink that can be used in a variety of applications. Its finned-tube structure makes it ideal for electronics and telecommunications applications where heat dissipation is a top priority. It is also highly effective at dissipating thermals from CPUs, memory modules, and storage devices. The efficient thermal dissipation and air convection capabilities make the ATS-21C-70-C2-R0 a great choice for cooling any device or component.
The specific data is subject to PDF, and the above content is for reference